| Allicdata Part #: | ATS-02F-145-C1-R0-ND |
| Manufacturer Part#: |
ATS-02F-145-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-145-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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。Thermal management plays an important role in the design of modern electronics applications, often involving the movement of heat from a hot source to a cooler area. The ATS-02F-145-C1-R0 is a passive heat sink which can be used to facilitate efficient and effective thermal management in various applications. This heat sink works by dissipating the heat from the source, and providing a low thermal resistance between the source and the ambient air.
The ATS-02F-145-C1-R0 is designed to fit into a variety of different applications, and is suitable for installation into a range of standard hole sizes. Its small size allows it to fit into confided spaces, making it suitable for smaller electronic devices. The ATS-02F-145-C1-R0 is made from high-grade aluminum and is designed to provide efficient thermal transfer. The aluminum used in its construction is lightweight and has excellent thermal conductivity, ensuring effective heat exchange between the device and its environment. The heat sink also includes a high-performance thermal interface material which covers a large area of the base, providing additional thermal protection.
The ATS-02F-145-C1-R0 is an effective choice for thermal management applications, with its small size and lightweight construction allowing it to be installed with minimal effort. The aluminum construction is designed to provide efficient heat transfer, while the thermal interface material assists in providing effective thermal protection. The passive design of the heat sink helps to reduce the thermal resistance between the device and the ambient air, ensuring that heat is dissipated effectively. This reduces the risk of overheating and ultimately results in improved performance.
The ATS-02F-145-C1-R0 is suitable for a wide range of applications, including automotive electronics, communications equipment, industrial electronics, and consumer electronics. It can be used in both new and existing designs, providing an efficient and cost-effective thermal management solution. The heat sink is easy to install and provides reliable performance in various operating conditions. As the heat sink does not require any additional power source, maintenance costs are kept low.
The ATS-02F-145-C1-R0 is a reliable and cost-effective way to regulate temperature in various electronics applications. Its passive design ensures that heat is quickly dissipated, reducing the risk of overheating. The aluminum construction also ensures efficient heat transfer, while the thermal interface material provides additional thermal protection. With its small size and lightweight construction, the ATS-02F-145-C1-R0 is a great choice for a range of applications and environments.
The specific data is subject to PDF, and the above content is for reference