| Allicdata Part #: | ATS-02F-15-C3-R0-ND |
| Manufacturer Part#: |
ATS-02F-15-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-15-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
Heat sinks are an essential component of thermal management and are used to transfer heat away from sensitive components, such as memory modules, CPUs, and motherboards. A heat sink is typically composed of an aluminum or copper base, which is then outfitted with a series of fins. Heat is transferred from the base to the fins via conduction and convection. The fins then provide a large surface area which the air can easily cool. Heat sinks are used in various electronic devices, such as computers, modems, and telephones, and can be produced in a variety of shapes, sizes, and materials.
ATS-02F-15-C3-R0 Application Field and Working Principle
The ATS-02F-15-C3-R0 is a type of heat sink designed to cool CPU, memory modules, and motherboards in computer systems. It is composed of a die-cast aluminum base and several aluminum fins that are designed to effectively dissipate heat away from the component being cooled. It is able to handle temperatures of up to 65°C without the need for external cooling fans. The fins provide a large surface area on which the heat can be efficiently dissipated. The aluminum fins are also coated with a black, electrolytically oxidized metal oxide, which further enhances the heat dissipation. Additionally, the heat sink comes with a clip that allows for easier installation and removal. The clip is designed to firmly secure the heatsink onto the component being cooled and prevent it from slipping during operation.
Performance and Advantages of ATS-02F-15-C3-R0
The ATS-02F-15-C3-R0 is an effective heat sink and provides efficient cooling performance. It is lightweight and compact, making it easy to install and remove. Its unique design allows it to easily accommodate larger components such as CPUs and memory modules. Additionally, the heat sink is coated with a black, electrolytically oxidized metal oxide, which further enhances its heat dissipation capabilities. It is capable of handling temperatures of up to 65°C without the need for external cooling fans, reducing the total amount of energy consumed by the system. Finally, the heatsink comes with a clip that firmly secures the heatsink onto the component being cooled and prevents it from slipping during operation. This makes the ATS-02F-15-C3-R0 a great choice for thermal management in computer systems.
Conclusion
In conclusion, the ATS-02F-15-C3-R0 is an excellent choice for thermal management in computer systems. This heat sink is composed of a die-cast aluminum base and several aluminum fins that are designed to efficiently dissipate heat away from the component being cooled. It is capable of handling temperatures up to 65°C without the need for external cooling fans, reducing the total amount of energy consumed by the system. Additionally, it is lightweight and compact and comes with a clip that allows for easy installation and removal. With its high performance and efficient heat dissipation capabilities, the ATS-02F-15-C3-R0 is an ideal choice for thermal management in computer systems.
The specific data is subject to PDF, and the above content is for reference