| Allicdata Part #: | ATS5290-ND |
| Manufacturer Part#: |
ATS-02F-16-C2-R0 |
| Price: | $ 4.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-02F-16-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.05090 |
| 10 +: | $ 3.94443 |
| 25 +: | $ 3.72506 |
| 50 +: | $ 3.50608 |
| 100 +: | $ 3.28690 |
| 250 +: | $ 3.06777 |
| 500 +: | $ 2.84864 |
| 1000 +: | $ 2.79387 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-02F-16-C2-R0 is a specialized thermal - heat sink device used in a variety of applications. It is constructed from state-of-the-art materials that provide superior heat dissipation abilities for electronic components while still offering lightweight and compact sizes. This heat sink is ideal for use in a wide variety of heat-sensitive electronic components such as microprocessors, processors, photovoltaic cells, and more.The ATS-02F-16-C2-R0 is specially designed to increase the thermal efficiency of electronic components by using its incredibly effective heat exchanger. This allows the device to quickly draw heat away from the electronic component, allowing it to operate at its maximum potential without overheating. This makes the ATS-02F-16-C2-R0 invaluable for high-powered electronics, offering over-the-top levels of protection for any components that could be damaged due to heat.The ATS-02F-16-C2-R0 also has a unique construction design. Its construction features stainless steel air/water channels, a porous substrate, and an oxidation-resistant black plating. The porous substrate maximizes the cooling effect by providing excellent thermal conductivity, and it also acts as a conductor, allowing for the heat to be evenly distributed throughout the device. Additionally, the oxidation-resistant black plating helps to prevent corrosion and rust formation, ultimately extending the life of the ATS-02F-16-C2-R0.To maximize the efficiency of the ATS-02F-16-C2-R0\'s performance, it is also equipped with advanced fan blades that are designed to move air efficiently between the heat sink and the components. The fan blades are made of a high-performance aluminum alloy that offers exceptional cooling performance due to its excellent thermal properties. The fan blades can run in either a single direction or an alternating direction, depending on the needs of the application.The ATS-02F-16-C2-R0 also has a wide range of mounting and installation options. This device can be mounted on almost any type of surface, including aluminum, steel, plastic, and various other materials. Additionally, the ATS-02F-16-C2-R0 is also equipped with a clip-on feature that allows for easy installation in tight spaces. This device is also equipped with a quick connection feature that makes it easy to integrate the device into existing systems.Overall, the ATS-02F-16-C2-R0 is a highly efficient and reliable thermal - heat sink device that offers a variety of features and benefits. Its advanced construction design ensures optimal performance for a variety of applications, while its varied installation options make it easy to use in tight spaces. In addition, its lightweight and compact size make it an ideal option for those looking for a way to significantly improve the thermal efficiency of their electronics while saving space. With its reliable performance and cost-effective price, the ATS-02F-16-C2-R0 is a great choice for any application requiring a thermal - heat sink device.
The specific data is subject to PDF, and the above content is for reference
ATS-02F-16-C2-R0 Datasheet/PDF