ATS-02F-171-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.28°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-02F-171-C1-R0

The ATS-02F-171-C1-R0 is a thermal - heat sink designed to dissipate a large amount of thermal energy generated by electronic components and other heat-producing devices. It is a highly efficient and cost-effective solution for applications that require heat removal from components or devices. The ATS-02F-171-C1-R0 is composed of a series of fins, each made from durable aluminum alloy material, and a specially designed air-gap between the fins for air circulation. This air-gap ensures maximum thermal energy dissipation and cooling. The ATS-02F-171-C1-R0 is designed for horizontal installation and can be directly mounted onto most electronic components and heat source devices.

Applications of ATS-02F-171-C1-R0

The ATS-02F-171-C1-R0 is perfect for applications that require efficient heat dissipation due to its ability to disperse thermal energy quickly and evenly. The product is especially beneficial in applications where electronic components and devices must be kept cool, such as PC gaming systems, computers, data centers, and other computing devices with high temperature requirements. The ATS-02F-171-C1-R0 is also great for industrial applications such as machinery and large electronics such as CNC machines and robotics.

Working Principle

The ATS-02F-171-C1-R0’s working principle is based on the natural phenomenon of convection, or the movement of air. When heat is generated by a component or device, the ATS-02F-171-C1-R0 absorbs and dissipates it quickly and efficiently by amplifying the natural convection process. The fins and air-gap of the device draw in heat from the component or device, absorbing it and dispersing it into the surrounding air. The fins also increase the surface area of the device to improve heat conduction and enhance the rate of heat transfer. The ATS-02F-171-C1-R0 is effective at quickly cooling components and devices, allowing them to operate at peak performance.

Conclusion

The ATS-02F-171-C1-R0 is an excellent thermal - heat sink designed to quickly and efficiently remove heat from components and devices. Its aluminum alloy fins and air-gap draw in heat, quickly dissipating it out into the surrounding air. This helps to ensure the proper functioning of the components and devices it is installed on, while keeping costs down. The ATS-02F-171-C1-R0 is perfect for a range of applications including PC gaming systems, computers, data centers, industrial machinery, and large electronics. It is an effective and cost-effective solution for applications that demand efficient thermal energy dissipation.

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