ATS-02F-173-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.68°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal – Heat Sinks: ATS-02F-173-C1-R0 application field and working principle

A heat sink is a device used to dissipate the heat generated by an electronic component into its surrounding environment. The heat sink works by increasing the surface area that is in contact with the ambient air, which allows the heat to transfer from the heat sink into the ambient air more efficiently. Heat sinks are commonly used in electronics such as processors, video cards, power supplies, and other components that generate heat.The ATS-02F-173-C1-R0 is a type of heat sink designed for specific applications. Heat sinks are rated based on several factors, including their thermal resistance, their cost, and their ability to dissipate heat efficiently in the environment. This particular heat sink has a thermal resistance of 0.02 °C per watt, which provides excellent heat dissipation capabilities. In addition, its cost is relatively low when compared to other heat sinks on the market. The ATS-02F-173-C1-R0 is designed for use in high-temperature environments. Its body material is made out of high-grade aluminum to handle the harsh temperatures. It also features a clip-on design, which makes it easy to install and remove. The clip-on design also helps to ensure maximum surface area contact with the heat source.The ATS-02F-173-C1-R0 is able to dissipate heat efficiently thanks to its patented single-fin design. This design uses a combination of thermally conductive aluminum and air spaces to dissipate the heat away from the heat source. This design maximizes the surface area available for heat transfer and reduces the thermal resistance of the connection between the heat source and the heat sink. To ensure maximum thermal performance, it is important that the ATS-02F-173-C1-R0 be installed correctly. The most important factor is that the heat sink be firmly attached to the heat source. This ensures that the heat transfer is as efficient as possible. It is also important to use thermal grease, which helps to fill in any air gaps between the heat source and the heat sink. This helps to increase the thermal conductivity of the connection between the two components and further improve the heat sink’s performance.In conclusion, the ATS-02F-173-C1-R0 is a highly efficient heat sink that is designed to dissipate heat in high-temperature environments. Its high thermal resistance and low cost make it perfect for applications in which efficiency is paramount. Its clip-on design and single-fin design make it easy to install and ensure maximum surface area contact with the heat source. Finally, it is important to install the ATS-02F-173-C1-R0 properly to ensure maximum performance.

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