ATS-02F-178-C3-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are an essential component of many devices and systems in use today, being used to effectively transfer heat away from delicate electronic circuitry in order to prevent damage and ensure reliable operation. Among the different types of heat sinks, one of the best performers is the recently developed ATS-02F-178-C3-R0. This article will discuss the application fields and working principle of this heat sink.

One of the most common applications of the ATS-02F-178-C3-R0 is as a cooling system for high-power electronic components, such as transistors, CPU chips, etc. It is composed of a minimalistic structure, with thin metallic fins that are placed up and down to increase the surface area and to provide an effective heat dissipation. This type of heat sink is extremely light-weight, weighing only 48g, and the small size (118.5x78.1x17.9mm) makes it ideal for use in mobile or portable applications. The wide range in operating temperature of this heat sink, ranging from -40° to + 85°C, also makes it suitable for use in harsh conditions.

Apart from cooling, the ATS-02F-178-C3-R0 is also an excellent choice for sound reduction. When placed into a system, it helps to reduce the level of noise emitted by the component by up to 70%. This makes the heat sink an ideal solution for applications such as laptop cooling, as well as quieter work and living spaces.

The ATS-02F-178-C3-R0 has also proven its value in energy-saving applications. In fact, it is often used in “energy-saving mode”, due to its improved energy performance and efficiency, relative to other heat sinks. As a result, it is being increasingly used in the energy-sensitive electronic components of many appliances.

So what is the working principle that is responsible for the excellent performance of the ATS-02F-178-C3-R0? The principle is based on the fact that the aluminum fins of the heat sink are designed to be thin and spaced out, so as to increase their surface area and thus provide an effective convection-based heat dissipation. This convection-based heat dissipation works by moving the hot air from the component away from it and thus helping to keep the component cool. This process occurs through the use of a heat conductive material, such as aluminum or copper, which forms a bridge between the component and the heat sink and helps to transfer the heat away from the component.

The ATS-02F-178-C3-R0 is proving a valuable ally in the world of thermal management and energy efficiency, and it will inevitably continue to be in demand in the near future. This heat sink can be found in many industrial, medical, military and consumer devices and has proven to be a reliable and efficient cooling solution. Its application fields include high-power electronic components, such as transistors, CPU chips, etc., as well as noise reduction, and energy-saving in energy-sensitive electronic components. Its working principle is based on convection, meaning that it moves the hot air away from the component and helps to keep it cool, making it an ideal choice for thermal management and energy efficiency.

The specific data is subject to PDF, and the above content is for reference