| Allicdata Part #: | ATS5317-ND |
| Manufacturer Part#: |
ATS-02F-184-C2-R0 |
| Price: | $ 4.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-184-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.03200 |
| 10 +: | $ 3.92112 |
| 25 +: | $ 3.70339 |
| 50 +: | $ 3.48541 |
| 100 +: | $ 3.26762 |
| 250 +: | $ 3.04978 |
| 500 +: | $ 2.83194 |
| 1000 +: | $ 2.77748 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are devices used to regulate the amount of generated heat and help dissipate that heat more efficiently. The ATS-02F-184-C2-R0 is a thermal-heat sink designed to provide improved performance in a variety of applications.
The ATS-02F-184-C2-R0 is an active thermal-heat sink that utilizes a combination of copper heat pipes and aluminium fins to maximise heat dissipation. Its baseplate is made from nickel-plated copper with a precision machined finish to maximise thermal performance. It features a clip-mount assembly process that eliminates the need for additional mounting hardware, making it easy to install with minimal effort in many different applications.
The ATS-02F-184-C2-R0 has a thermal resistance of 0.32°C/W and its large baseplate and heat dissipation area coupled with its aluminium fins provide efficient heat dissipation from the source component to the environment. Its shape and design allow it to fit into tight spaces while still providing superior performance and cooling. It is designed to provide effective cooling for applications such as high-power CPUs, ASICs, GPUs, and other high-power components.
The ATS-02F-184-C2-R0\'s working principle is based on the natural process of thermodynamics, in which heat is transferred between two substances or two points of different temperatures. Heat transfers from the source component to the heat sink fins, which absorb the heat while providing a path to the surrounding environment. This process dissipates heat more efficiently than relying on simple air cooling, resulting in improved thermal performance.
The ATS-02F-184-C2-R0\'s applications include electronic chipsets and processors, graphics cards, sensors, and power components such as MOSFETs and IGBTs. It can also be used in automotive, industrial, and other applications that require effective cooling and low thermal resistance. Furthermore, the heat sink\'s capacity for providing a large heat dissipation area and its highly efficient natural process of heat transfer make it ideal for design applications requiring superior thermal performance.
The ATS-02F-184-C2-R0 is an effective and reliable active thermal-heat sink that offers superior cooling solutions for many different types of applications. Its combination of copper heat pipes, aluminium fins, and a precision machined nickel-plated copper baseplate maximize thermal performance and efficiency, while its clip-mount design eliminates the need for additional mounting hardware. This makes it easy to install and provides excellent thermal performance, making it a great choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference