| Allicdata Part #: | ATS-02F-192-C1-R0-ND |
| Manufacturer Part#: |
ATS-02F-192-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-192-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important components in the design of any electronics equipment. Heat sinks are used to dissipate the heat generated by internal components such as microchips, processors, and other high-powered circuits. By dissipating the heat, the components can be protected from becoming damaged due to excessive heat. In order for the heat sink to be effective, it needs to be made of a material that is able to dissipate heat quickly and efficiently. The material used for this purpose is typically aluminum.
The ATS-02F-192-C1-R0 is a type of heat sink specifically designed for the purpose of dissipating heat from electronics equipment. It is made of aluminum, which makes it both lightweight and highly efficient at dissipating heat. The ATS-02F-192-C1-R0 is a rectangular heat sink with a length of 192mm (7.56") and a width of 75mm (3.0"). It also has a height of 30mm (1.18") and a finned area of 0.152m. The heat sink also features a large number of cooling fins, which helps to dissipate heat more efficiently.
The ATS-02F-192-C1-R0 is designed for use in the electronics industry, particularly in the design of laptops, tablets, and other consumer electronics products. The ATS-02F-192-C1-R0 is designed to be used with single-core to multi-core processors from Intel and AMD. It comes with an integrated fan, which helps to keep the heat sink cool and further decrease the operating temperature of the processor. As for its working principle, the ATS-02F-192-C1-R0 is designed to increase the rate of heat transfer from the source (processor) to the ambient air. This is achieved by providing a large surface area for rapid heat dissipation and by using the fan to help evacuate the hot air away from the processor.
In conclusion, the ATS-02F-192-C1-R0 is an effective and reliable heat sink for use in electronics applications. It is lightweight and highly efficient at dissipating heat, and comes with a built-in fan to help further reduce the operating temperature of the processor. Its design ensures that heat is quickly and efficiently transferred away from the processor, making it a great choice for any electronics application.
The specific data is subject to PDF, and the above content is for reference