| Allicdata Part #: | ATS-02F-197-C1-R0-ND |
| Manufacturer Part#: |
ATS-02F-197-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-197-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.80539 |
| 30 +: | $ 2.72979 |
| 50 +: | $ 2.57809 |
| 100 +: | $ 2.42645 |
| 250 +: | $ 2.27480 |
| 500 +: | $ 2.19898 |
| 1000 +: | $ 1.97149 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – heat sinks provide a cooling solution to components that require more heat dissipation than traditional air-cooled solutions can provide. Thermal – heat sinks work on the principle of transferring heat away from the component and then dissipating it into the air. The thermal – heat sinks use fins made from aluminum or copper, both of which have high heat transfer properties. These fins increase the surface area which allows for more efficient cooling. As air passes over the fins, the heat is dissipated away from the component and into the air.
The ATS-02F-197-C1-R0 heat sink is a high-performing product from the ATS family of thermal interrupt products. It is built with the latest design and construction standards to achieve exceptionally high thermal performance and reliability. This heat sink is designed to provide efficient cooling for devices that need to dissipate high amounts of energy quickly and reliably. The ATS-02F-197-C1-R0 heat sink features a BGA-style metal base with an integrated base plate and a special thermal resistance design. The BGA-style metal base and integrated base plate provide superior heat dissipation, which significantly reduces the thermal resistance of the device over time.
The ATS-02F-197-C1-R0 heat sink utilizes a unique fin construction which allows for increased airflow and improved cooling performance. The fins are made from high-quality aluminum or copper and feature a super-thin profile for maximum efficiency. The thin fins provide a greater surface area for heat to dissipate evenly and quickly. Additionally, the thermal resistance design of the fins helps to reduce the amount of heat lost to the environment.
The ATS-02F-197-C1-R0 heat sink is a great option for various types of applications including power supplies, embedded systems, industrial computers, servers, and other similar high-power applications. The device has an integrated airflow system to ensure that hot air is quickly dissipated from the component. Additionally, the wide variety of mounting options allows for easy installation and customization. This heat sink is also designed for durability and extended use, ensuring that it can withstand harsh environments and extreme temperatures.
In conclusion, the ATS-02F-197-C1-R0 heat sink is a reliable and high-performance thermal solution designed for applications requiring efficient cooling. The device is built with the latest design and construction standards in order to achieve maximum thermal efficiency and reliability. The integrated design of the fins allows for efficient heat dissipation, and the wide range of mounting options make installation and customization easy. This heat sink is an excellent option for various applications and can provide reliable and efficient cooling solutions.
The specific data is subject to PDF, and the above content is for reference