| Allicdata Part #: | ATS-02F-197-C3-R0-ND |
| Manufacturer Part#: |
ATS-02F-197-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-197-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is becoming increasingly important in today’s ever-evolving electronics and semiconductor industry. Heat sinks are used to dissipate heat away from the heat source, keeping components cool and improving overall system reliability. One such heat sink is the ATS-02F-197-C3-R0, which is designed to provide an efficient thermal management solution. In this article, we’ll take a closer look at the ATS-02F-197-C3-R0’s application fields, and how it works.
Application Field
The ATS-02F-197-C3-R0 is a heat sink that is designed to be used in high-power electronics throughout many industries such as aerospace, medical, military, and automotive. In particular, this heat sink is designed for use in applications where reliable thermal management solutions are necessary for a wide range of ambient temperatures and power levels. This heat sink is also capable of accommodating small boards with limited space and, because of its high efficiency, it is also well suited for applications in remote control or hand-held equipment.
This heat sink also offers superior thermal performance when compared to other heat sinks on the market, thanks to its high-performance cooling fins, which are designed to maximize surface area and minimize resistance. This allows the ATS-02F-197-C3-R0 to effectively dissipate heat around the component, keeping it cool and reducing the risk of component failure due to overheating.
Working Principle
The ATS-02F-197-C3-R0 is designed to be installed between a power source and the device that it is cooling. The heat sink features high-performance cooling fins, which greatly increase its surface area, giving it more area to dissipate heat. The fins also reduce the risk of obstruction between the power source and the device, ensuring maximum efficiency.
The heat sink also utilizes natural convection, which capitalizes on the natural force of hot air rising. This allows the hot air from the power source to effectively travel over the fins of the heat sink, where it dissipates the heat away from the component. This provides a very efficient means of cooling, and ensures that the component doesn’t suffer from unnecessary stress due to overheating.
The ATS-02F-197-C3-R0 heat sink also features a low-profile design, which is ideal for tight spaces. This makes it the perfect choice for applications where space is limited and the device needs to remain as compact as possible. Additionally, its low-profile design helps reduce the risk of physical obstruction from other components, allowing it to dissipate heat more efficiently.
Conclusion
The ATS-02F-197-C3-R0 is an efficient thermal management solution designed for use in high power electronics. It features a high-performance cooling fin design that increases its surface area and minimizes resistance, allowing it to effectively dissipate heat away from the component. Additionally, its low-profile design makes it the perfect choice for applications where space is limited. Ultimately, the ATS-02F-197-C3-R0 is an excellent choice for any application that requires reliable thermal management solutions.
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