ATS-02F-20-C3-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks play an important role in cooling electronic components and devices. They are typically used to absorb heat generated by a component or device and dissipate it away from the source. The ATS-02F-20-C3-R0 is an example of an advanced heat sink architecture designed to protect sensitive electronic components from high temperatures. This article will discuss the applications and working principles of the ATS-02F series of heat sinks.

Applications of ATS-02F-20-C3-R0

The ATS-02F-20-C3-R0 is a thermal heat sink designed specifically for cooling high-powered electronic components that have a large heat output, such as high-end CPUs and GPUs. It is designed to provide an effective cooling solution for components that are sensitive to high temperatures by extracting heat from the component and dissipating it away from the source. The ATS-02F-20-C3-R0 features an aluminum extrusion base and fin design that offer superior heat dissipation capabilities. The fin design allows for improved thermal contact between the heat source and the fin surface, while the extrusion base helps to evenly distribute the generated heat.

The ATS-02F-20-C3-R0 is designed with a patented adhesive technology that helps to improve the thermal contact between the heat sink and the electronic component. This technology helps to ensure that the heat sink maintains a strong, secure connection to the component at all times. Additionally, the ATS-02F-20-C3-R0 is highly efficient, producing a maximum operating temperature of 50°C. This ensures that sensitive components remain safe and operating at optimal temperatures.

Working Principle of ATS-02F-20-C3-R0

The ATS-02F-20-C3-R0 features a unique and advanced thermal solution, which works to effectively transfer heat away from sensitive components. The heat sink utilizes a combination of a fin (and extrusion) base design and an efficient adhesive technology to ensure maximum heat transfer between the heat source and the fin surface. The fin design works to increase the surface area of the heat sink, allowing for better heat dissipation. The adhesive technology, on the other hand, helps to improve the thermal contact between the heat source and the fin surface, providing a secure, stable connection between the two components.

The ATS-02F-20-C3-R0 utilizes a heat transfer system which operates on the principle of heat conduction. Heat transfer takes place when energy passes from a hotter substance to a colder substance. In this case, heat is transferred from the electronic component to the fin, and then from the fin to the environment. The fin acts as a middle-man, absorbing the heat from the component and dissipating it away from the source. This process helps to maintain optimal operating temperatures for the component, ensuring that the component remains safe and performing at its peak efficiency.

Conclusion

In conclusion, the ATS-02F-20-C3-R0 is an advanced and effective thermal heat sink solution designed to protect sensitive electronic components from high temperatures. Its advanced fin and adhesive technology helps to transfer heat away from the component, providing an efficient cooling solution. Furthermore, the ATS-02F-20-C3-R0 is highly efficient and produces a maximum operating temperature of 50°C, ensuring that sensitive components remain safe and operating at optimal temperatures.

The specific data is subject to PDF, and the above content is for reference