| Allicdata Part #: | ATS-02F-24-C1-R0-ND |
| Manufacturer Part#: |
ATS-02F-24-C1-R0 |
| Price: | $ 4.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-24-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.08303 |
| 30 +: | $ 3.85623 |
| 50 +: | $ 3.62943 |
| 100 +: | $ 3.40257 |
| 250 +: | $ 3.17573 |
| 500 +: | $ 2.94889 |
| 1000 +: | $ 2.89218 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-02F-24-C1-R0 is a type of thermal heat sink, and it is particularly well-suited for dissipating large amounts of heat from crowded printed circuit board (PCB). This particular type of heat sink is particularly specialized for cooling electronics components such as microcontrollers, ASICs, CPUs, memory chips, and other integrated circuits. It consists of a frame, a base, and a series of fins.
The frame of the ATS-02F-24-C1-R0 is made of aluminum, and it is designed to stand up to extreme temperatures. It is highly resistant to corrosion and abrasion, and it is also lightweight. The base of the heat sink is also made of aluminum, and it serves to securely attach the sink to the PCB. The fins are made of a highly conductive material that helps to rapidly transfer heat away from the components. The fins are designed to maximize air-flow around the components, and this helps to dissipate heat more efficiently.
The ATS-02F-24-C1-R0 is primarily used in applications where rapid cooling is essential, such as in high-powered electronic circuits. It is also an excellent choice for thermally sensitive components such as voltage regulators, as the fins provide superior cooling compared to standard passive heat sinks. The ATS-02F-24-C1-R0 is also capable of handling extreme temperatures (up to 175°C), making it suitable for use in high-pressure environments.
The primary purpose of using the ATS-02F-24-C1-R0 as a thermal heat sink is to effectively manage heat dissipation. This is achieved by transferring the heat away from the components and dissipating it into the ambient air. This is accomplished through convection, which is the process by which heat is lost from a hot object to a cooler object. The increased surface area of the fins helps to promote convection, and the aluminum frame and base serve to increase heat dissipation.
In addition to managing heat dissipation, the ATS-02F-24-C1-R0 is also designed to reduce system noise. This is accomplished by effectively absorbing and dampening mechanical vibrations, as well as dissipating excess heat. The increased surface area of the fins also helps to reduce system noise, as it helps to quickly disperse heat away from the components.
Overall, the ATS-02F-24-C1-R0 is an excellent choice for cooling high-power electronic components. It is capable of dissipating large amounts of heat efficiently, and it is also designed to reduce system noise. It is highly resistant to corrosion and abrasion, and it is also able to withstand extreme temperatures. The increased surface area of the fins helps to promote convection, and the aluminum frame and base help to dissipate heat effectively.
The specific data is subject to PDF, and the above content is for reference