| Allicdata Part #: | ATS5355-ND |
| Manufacturer Part#: |
ATS-02F-30-C2-R0 |
| Price: | $ 8.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-30-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 7.99470 |
| 10 +: | $ 7.54866 |
| 25 +: | $ 7.10465 |
| 50 +: | $ 6.66061 |
| 100 +: | $ 6.21652 |
| 250 +: | $ 5.77249 |
| 500 +: | $ 5.66147 |
| 1000 +: | $ 5.55046 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are devices used to dissipate heat, typically through convection and radiation. Heat sinks are an important part of electronic circuits, particularly in power electronics where the large currents and voltages require proper cooling to maximize the lifetime of the components. The ATS-02F-30-C2-R0 is a type of heat sink used in electronic circuits and is designed for thermal management to ensure maximum operating performance and reliability of electronic devices.
The ATS-02F-30-C2-R0 is composed of an aluminium alloy frame and is designed to support up to 8W of power devices. This product is certified for use in harsh environment which makes it suitable for use in demanding applications. The aluminium alloy composition provides high thermal conductivity and resistance to oxidation and corrosion, thus extending the longevity of the heat sink. The frame is constructed with 30 mm cooling fins which allows for maximum surface area and air circulation, providing more efficient cooling and reduction in the temperature of the active components.
The ATS-02F-30-C2-R0 comes with two aluminium alloy pin fins designed to direct air flow from the surrounding environment to the heat conducting surface, for faster cooling. The pins are engineered to reduce turbulence and noise, providing an optimal operation of the heat sink. The product also comes with factory pre-applied thermally conductive adhesive allowing for secure mounting to any devices, thus eliminating extra assembly steps. The adhesive is also designed to maintain its performance over a wide temperature range.
The ATS-02F-30-C2-R0 is designed to be a passive cooled heat sink, meaning that it does not have any active components, such as fans, to help cooling. Instead, this type of heat sink relies on natural convection of the surrounding air to dissipate heat from the active components. The air circulates around the cooling fins, absorbing the heat and transporting it away from the active components. This process is repeated until the temperature of the device and the surrounding air is equalised and the heat is dissipated.
Heat sinks can be used in a variety of applications and the ATS-02F-30-C2-R0 is ideal for controlling the temperature of high power devices. The heat sink is suitable for power amplifiers, small audio amplifiers, power rectifiers and radio frequency transistors. The heat sink is also used in high speed digital drivers, controller cooling systems, and it can be used in cooling applications in automotive and industrial applications.
In conclusion, the ATS-02F-30-C2-R0 is a type of thermal-heat sink ideal for use in controlling the temperature of high power devices. The aluminium alloy frame provides high thermal conductivity and resistance to oxidation and corrosion, while the two aluminium alloy pin fins direct air flow for faster cooling. The product also comes with factory pre-applied thermally conductive adhesive allowing for secure mounting. The ATS-02F-30-C2-R0 is suitable for applications such as power amplifiers, small audio amplifiers, power rectifiers and radio frequency transistors.
The specific data is subject to PDF, and the above content is for reference