| Allicdata Part #: | ATS-02F-30-C3-R0-ND |
| Manufacturer Part#: |
ATS-02F-30-C3-R0 |
| Price: | $ 8.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-30-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 7.31934 |
| 30 +: | $ 6.88861 |
| 50 +: | $ 6.45813 |
| 100 +: | $ 6.02759 |
| 250 +: | $ 5.59705 |
| 500 +: | $ 5.48941 |
| 1000 +: | $ 5.38177 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks are an integral part of electronics and computer systems. Today, they are found in a variety of applications, ranging from mobile and handheld devices to servers and mainframe computers. This makes the selection of the appropriate model critical in ensuring proper operation and stability. The ATS-02F-30-C3-R0 Thermal Heat Sink has been designed for efficient heat dissipation, making it ideal for a range of applications.
The ATS-02F-30-C3-R0 is a high quality thermal heat sink with an aluminum fin extrusion and an anodized finish. It supports a thermal resistivity of 30°C/W, ensuring efficient heat transfer and dissipation. The through-hole PDIP design makes the heat sink easy to install and is suitable for a range of PCB designs. The fin-laminar construction of the ATS-02F-30-C3-R0 ensures optimal thermal performance, allowing the heat to be evenly dispersed away from the module.
In applications where the thermal load of the component must be dissipated quickly, the ATS-02F-30-C3-R0 is a great choice. It is suitable for cooling components such as transistors, voltage regulators, power amplifiers, and motor drives. In addition, it can help keep the temperature of the surrounding area cool and reduce the occurrence of thermal runaway. The ATS-02F-30-C3-R0 is also a great choice for medical, commercial, and military applications where a reliable cooling solution is required.
The ATS-02F-30-C3-R0 model features a special pin-and-socket connection that allows the heat sink to be easily installed and unbolted. The pins are designed to fit in any size of threaded hole, giving the user the flexibility to create custom mounting solutions. The socket design also simplifies the process of replacing the heat sink if it needs to be updated to a different model, such as the ATS-03F-50-C3-R0.
The ATS-02F-30-C3-R0 is a highly efficient thermal heat sink that can be used in a variety of applications. Its design ensures efficient heat dissipation by evenly distributing the thermal load away from the component. The pin-and-socket design makes it easy to install and customize, making it a great choice for any heating or cooling application.
The specific data is subject to PDF, and the above content is for reference