| Allicdata Part #: | ATS-02F-47-C1-R0-ND |
| Manufacturer Part#: |
ATS-02F-47-C1-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-47-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components in many electronic devices. They help reduce the temperature of the device\'s components by dissipating heat away from them. The efficiency of heat sinks is largely dependent on the application field and working principle. One type of heat sink, the ATS-02F-47-C1-R0, has gained widespread popularity due to its high efficiency and versatile applications.
The ATS-02F-47-C1-R0 is a multi-functional heat sink designed for use in most kinds of electronic equipment. It has a simple design with a number of fins constructed of extruded aluminum. The heat sink also comes equipped with a fan mounted on its top to aid in cooling. The fan helps to circulate the air inside the device, ensuring that the heat is dispersed more evenly. In addition, the ATS-02F-47-C1-R0 comes with several integrated thermal conduction plates that help to further improve the efficiency of the device.
When it comes to its actual application, the ATS-02F-47-C1-R0 is most commonly used in a wide variety of electronic devices, such as computers, laptops, gaming consoles, and medical equipment. The heat sink is also capable of dissipating heat during high-temperature applications like welding, soldering, and laser marking. Furthermore, the ATS-02F-47-C1-R0 is very versatile and can be installed in almost any device that requires thermal management.
The ATS-02F-47-C1-R0 works by absorbing the heat produced by the electronic components and then transferring the heat through the fins. This increases the surface area of the heat sink, allowing it to dissipate more heat away from the device\'s components. The fan mounted on top of the heat sink further helps to circulate the air within the device, ensuring that the heat generated is dispersed more evenly. The heat is then dissipated outside the component, thus keeping the device\'s temperature at an acceptable level.
The ATS-02F-47-C1-R0 is an effective thermal management solution and provides a versatile platform for cooling electronic components within almost any type of device. Its simple design and multiple integrated features make it easy to install and use. In addition, its high efficiency and reliable performance make it an ideal choice for heat sink applications in a wide range of industries.
The specific data is subject to PDF, and the above content is for reference