ATS-02F-50-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.99°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-02F-50-C1-R0 Thermal-Heat Sinks Application Field and Working Principle

Thermal-heat sinks are essential components in electronics systems as they are responsible for dissipating heat produced by the electrical components. A well-designed thermal-heat sink can help to extend the lifetime of the components, prevent them from being overheated and providing normal operation of the entire system. The ATS-02F-50-C1-R0 thermal-heat sink is a type of active cooled thermal-heat sink specifically developed to help reduce heat dissipation levels while cooling.

Types of ATS-02F-50-C1-R0 Thermal-Heat Sinks

The ATS-02F-50-C1-R0 thermal-heat sinks are usually divided into two basic types: active cooled and passive cooled. An active cooled thermal-heat sink is a device that relies on the controlled forced air circulation to provide the cooling capability. On the other hand, a passive cooled thermal-heat sink does not use any external power source or fan, but relies on the natural convection of the air around the device.

Application Fields

The ATS-02F-50-C1-R0 thermal-heat sink can be applied in a variety of different fields such as automotive electronics, computers and consumer electronics. The thermal-heat sinks are used to efficiently cool any overly-heated components, such as CPUs, video cards, ASICs and other integrated circuits in electronic products. As such, they can be used wherever temperature regulation is necessary to ensure long-term operation of the product.

Working Principle

The ATS-02F-50-C1-R0 thermal-heat sink works by transferring heat from the device to its dissipating fins. The thermal-heat sinks utilise the principle of thermal conduction and convection to transfer heat away from the heat generating component. In a passive cooled thermal-heat sink, the device is designed to facilitate convective flow of air around the fins. As the air circulates around the fins, it absorbs heat which is then transferred away from the component. The amount of heat dissipated is determined by the surface area of the fins, which has to be large enough to allow for proper heat dissipation. An active cooled thermal-heat sink on the other hand uses a fan to actively expel hot air from the device. This enables a more efficient cooling system, as it uses the fan to actively remove the heat generated by the component rather than relying on the natural convection process. As such, active cooled thermal-heat sinks are often used in conditions where the temperature of the components needs to be tightly controlled.

Conclusion

The ATS-02F-50-C1-R0 thermal-heat sink is an efficient and reliable solution for controlling overheating components in electronic systems. They are capable of dissipating heat away from the components at a faster rate than passive cooled thermal-heat sinks, making them suitable for applications that require precise temperature control. Therefore, this type of thermal-heat sink is an ideal choice for automotive electronics, computers and consumer electronics products.

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