| Allicdata Part #: | ATS-02F-53-C1-R0-ND |
| Manufacturer Part#: |
ATS-02F-53-C1-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-53-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44736 |
| 30 +: | $ 3.35433 |
| 50 +: | $ 3.16802 |
| 100 +: | $ 2.98166 |
| 250 +: | $ 2.79531 |
| 500 +: | $ 2.70213 |
| 1000 +: | $ 2.42260 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal and heat sinks play an important role in helping electronic components maintain optimal operating temperatures. ATS-02F-53-C1-R0 is a heat sink used in many industrial and commercial applications. This article will discuss the application field of the ATS-02F-53-C1-R0 heat sink, as well as its working principle.
The ATS-02F-53-C1-R0 heat sink is primarily designed to dissipate heat from electronic components. It is constructed from aluminum alloy and anodized to provide superior corrosion resistance. The heat sink features multiple fins, ensuring efficient heat dissipation and low thermal resistance. It is also designed with an open design to allow for proper air flow and optimal cooling. The ATS-02F-53-C1-R0 heat sink is ideal for a variety of industrial and commercial applications, including disc drive enclosures, telecommunication systems, and electrical equipment.
The working principle of the ATS-02F-53-C1-R0 heat sink is simple and efficient. The heat sink absorbs heat from the device it is attached to and dissipates it into the air. The fins on the heat sink increase the surface area exposed to the air, allowing more heat to be absorbed and dissipated. The fins also allow air to flow across the surface of the heat sink, helping to cool the surrounding environment. As the device gets hotter, more air is forced through the fins, dissipating more heat.
The ATS-02F-53-C1-R0 heat sink is an effective and efficient way to help keep electronic components from overheating. It can be used in a variety of industrial and commercial applications, including those involving electrical equipment and telecommunication systems. Its open design allows for proper air flow and efficient heat transfer, and its multiple fins help to dissipate heat effectively. With proper installation and maintenance, the ATS-02F-53-C1-R0 heat sink can provide reliable cooling for your electronic components.
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