| Allicdata Part #: | ATS-02F-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-02F-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronics is an important issue in modern society. With the ever-increasing demand for higher performance and greater reliability of consumer electronics, heat dissipation has become a major concern for many electronic systems. Heat sinks are commonly used to reduce the temperature of electronic components through dissipating the heat generated by the circuits. The ATS-02F-73-C1-R0 heat sink is a commonly used thermal solution for many types of electronic components.
The ATS-02F-73-C1-R0 heat sink is a high performing aluminum-finned heat sink with an anodized finish. This heat sink is designed to provide efficient heat dissipation without any additional measures such as forced air flow. It features a wide baseplate that has a large surface area, while the fins provide additional surface area, resulting in increased thermal performance. With a high surface area, the heat generated by the electronic components is evenly dispersed, resulting in a more efficient cooling process.
The ATS-02F-73-C1-R0 heat sink has several key features which make it an ideal thermal solution for a wide range of applications. First of all, it has a low profile design which ensures that the components attached to the heat sink will not encroach on critical internal PCB components. Additionally, the anodized finish greatly increases the durability of the heat sink and provides a better resistance to corrosion. The heat sink also features a slotted mounting system which allows for easy installation and removal of components.
In terms of application, the ATS-02F-73-C1-R0 heat sink can be used in a wide variety of electronic systems ranging from embedded systems to industrial electronics. It is particularly useful in systems where low profile designs are required, as it can provide efficient cooling without blocking other components. Likewise, the wide baseplate and slotted mounting system make the heat sink suitable for many types of removables.
The ATS-02F-73-C1-R0 heat sink works on the principle of convection. Heat is generated by the electronic component and is dissipated by natural convection currents in the heat sink. The large surface area of the heat sink helps to increase the total amount of air that comes into contact with the fins. This increases the effectiveness of the heat dissipation as more air can be heated and carried away from the heat sink.
In conclusion, the ATS-02F-73-C1-R0 heat sink is a versatile thermal solution that can be used in a variety of applications. Its low profile design, durable anodized finish, and wide baseplate make it ideal for many types of embedded and industrial electronic systems. Additionally, its highly efficient convection cooling principle ensures that heat is quickly and effectively dissipated, helping to improve the overall performance of the system.
The specific data is subject to PDF, and the above content is for reference