| Allicdata Part #: | ATS-02F-73-C3-R0-ND |
| Manufacturer Part#: |
ATS-02F-73-C3-R0 |
| Price: | $ 3.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-73-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.01959 |
| 30 +: | $ 2.93790 |
| 50 +: | $ 2.77477 |
| 100 +: | $ 2.61154 |
| 250 +: | $ 2.44831 |
| 500 +: | $ 2.36669 |
| 1000 +: | $ 2.12187 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 29.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-02F-73-C3-R0 is a type of thermal - heat sink and plays a very important role in heat dissipation. It operates on the basis of the principle of thermal conduction, which states that heat is approximately transferred between two objects that are in direct contact with each other. Therefore, the primary purpose of the ATS-02F-73-C3-R0 is to allow a good thermal interface between the hot and cold sources and facilitate the efficient thermal transfer of heat.
The ATS-02F-73-C3-R0 is composed of several different components in its design– a base part, aluminum fins, and thermal interface material (TIM). The base part is an aluminum plate that is molded with four mounting holes that will form the base of the heat sink. It also acts as a heat conductor, since it will be in direct contact with the hot source. On top of the base, there are aluminum fins which act as a surface for air to come in contact with. This is to ensure that there is enough surface area for the heat sink to dissipate the heat it collects from the hot source. Finally, the TIM acts as a medium to allow proper thermal transfer between the heat sink and the hot source.
The primary application of the ATS-02F-73-C3-R0 is for effective heat dissipation in electronic components and devices. This is because heat is generated from the circuitry, and if it is not dissipated, it will build up and end up damaging the electronic components. With the aid of a ATS-02F-73-C3-R0, the heat can be spread over a larger area and is allowed to dissipate into the surrounding environment.
The ATS-02F-73-C3-R0 also has a variety of other applications, such as in servers, computers, graphics cards, and memory modules. It is also applicable in reheat and cool-down processes in industrial manufacturing. In these cases, the ATS-02F-73-C3-R0 is able to provide an efficient and reliable cooling solution for these components and devices, enabling them to operate at optimal performance.
The ATS-02F-73-C3-R0 heat sink is an easy to install and reliable thermal management tool. The design of the ATS-02F-73-C3-R0 is specifically tailored for devices that require adequate heat dissipation while maintaining optimal performance. It is made of high-quality aluminum and is designed with durability in mind, making it a long-lasting solution for any application that requires effective heat dissipation.
The specific data is subject to PDF, and the above content is for reference