ATS-02F-75-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-02F-75-C3-R0-ND

Manufacturer Part#:

ATS-02F-75-C3-R0

Price: $ 3.44
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X20MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02F-75-C3-R0 datasheetATS-02F-75-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.12669
30 +: $ 3.04206
50 +: $ 2.87305
100 +: $ 2.70409
250 +: $ 2.53507
500 +: $ 2.45056
1000 +: $ 2.19705
Stock 1000Can Ship Immediately
$ 3.44
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.29°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-02F-75-C3-R0 is an advanced thermal management technology which is used in heat sink applications. This technology is based on the principle of using a combination of passive and active heat transfer to provide optimal cooling for a variety of electronic components. The ATS-02F-75-C3-R0 has been designed to provide high heat dissipation in a wide range of environmental conditions, making it an ideal solution for a variety of electronic cooling requirements in a variety of applications.

The ATS-02F-75-C3-R0 operates by combining its basic thermal design principles with additional features that enable it to reduce thermal cycling and protect components from thermal overload. The ATS-02F-75-C3-R0 utilizes an internal heat sink element and a fan to cool internally. It consists of a series of metallic fins which are designed to increase the surface area which is exposed to the air. This enables a significantly higher rate of heat dissipation than typical non-heat sink designs, while simultaneously providing efficient cooling to the important components it is designed to protect.

The ATS-02F-75-C3-R0 works by utilizing a fan which is connected to the heat sink. The fan rotates at a predetermined speed and, by use of the fins on the heat sink, provides the necessary airflow to properly dissipate the heat generated. The rotating fan creates an air vortex at its base which draws air through the fins and dissipates the heat produced by the components. In addition, the fan is designed to be as quiet as possible, so as to ensure that it can operate in a variety of application settings without causing a distraction or disruption.

The ATS-02F-75-C3-R0 also incorporates a number of safety features to help prevent damage to electronic components caused by thermal cycling. This includes a dual-temperature heat sensor to detect when the rate of temperature rise exceeds the pre-defined safety limit. When this happens, the fan can be automatically adjusted to reduce the temperature and protect the components from further damage. This ensures that the fan always operates at the optimal level for effective cooling.

The ATS-02F-75-C3-R0 also features a number of other features that make it an ideal choice for a variety of applications. This includes a wide range of mounting options that allow it to be installed in a variety of spaces within an electronic assembly. It is also easy to install, as it utilizes a standard clip-in installation and requires minimal assembly time. It is also highly durable, as it is constructed with a durable metal material which resists corrosion and extreme temperatures.

The ATS-02F-75-C3-R0 is an ideal choice for any application requiring efficient cooling in a range of environmental settings. With its advanced thermal management technology, safety features, and wide range of mounting options, it provides an optimal solution for a variety of thermal requirements. By combining passive and active heat transfer, the ATS-02F-75-C3-R0 provides the optimal cooling solution for a variety of electronic components.

The specific data is subject to PDF, and the above content is for reference

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