ATS-02F-79-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-02F-79-C3-R0-ND

Manufacturer Part#:

ATS-02F-79-C3-R0

Price: $ 3.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X10MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02F-79-C3-R0 datasheetATS-02F-79-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.16197
30 +: $ 3.07671
50 +: $ 2.90581
100 +: $ 2.73489
250 +: $ 2.56397
500 +: $ 2.47851
1000 +: $ 2.22211
Stock 1000Can Ship Immediately
$ 3.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 26.55°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

ATS-02F-79-C3-R0 is a thermal heat sink designed for a variety of applications. The device is designed to dissipate heat generated by electronic components, such as CPUs, GPUs, and other devices, allowing for efficient thermal management and increased performance. In this article, we will look at the application field and working principle of the ATS-02F-79-C3-R0 Thermal Heat Sink.

Application Field

The ATS-02F-79-C3-R0 thermal heat sink is designed for applications such as cooling high-performance CPUs and GPUs for gaming PCs, workstations, and servers. The device is also suitable for industrial and automotive electronics cooling, cooling of medical and military electronics, and cooling of consumer electronics such as set-top boxes and home appliances. The device is also suitable for cooling devices operating at higher frequencies as well as high-performance processors.

The ATS-02F-79-C3-R0 has a thermal resistance rating of 0.4 °C/W and a maximum recommended temperature of 75 °C, making it an ideal candidate for cooling high-heat-generating devices. The device features a fan-style aluminum heat sink with an extruded base for maximum heat dissipation. The device has a built-in fan for accelerated cooling, and the fan is optimized to produce low noise for a quiet operation.

Working Principle

The ATS-02F-79-C3-R0 thermal heat sink operates on a process called Thermodynamics. This process is the science of heat transfer. Heat transfer occurs when warm molecules collide with cool molecules, causing energy to be transferred from one medium to another. Heat sinks like the ATS-02F-79-C3-R0 work on the principal that heat pulled from one surface is dispersed into another. As a result, heat from devices such as CPUs or GPUs is pulled away and dispersed into the surrounding environment.

In the case of the ATS-02F-79-C3-R0, a fan is located at the base of the device. This fan draws in air from the surrounding environment and disperses it across the surface of the device. The fan accelerates the process of heat transfer, allowing for increased thermal management performance. The fan also keeps the device running at a low noise level.

The device has a low thermal resistance rating of 0.4 °C/W. This means that it is capable of dissipating more heat than other devices with a high thermal resistance rating. Additionally, the device has a maximum recommended temperature of 75 °C, making it suitable for cooling high-heat-generating devices.

Conclusion

The ATS-02F-79-C3-R0 thermal heat sink is a great choice for cooling high-performance devices. The device operates on the principle of thermodynamics, where heat is transferred from one medium to another. The device features a fan-style aluminum heat sink with an extruded base for maximum heat dissipation, as well as a built-in fan for accelerated cooling. The device has a low thermal resistance rating of 0.4 °C/W and a maximum recommended temperature of 75 °C, making it suitable for high-heat-generating devices. This makes the ATS-02F-79-C3-R0 a great choice for gaming PCs, workstations, and servers, as well as industrial and automotive electronics.

The specific data is subject to PDF, and the above content is for reference

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