| Allicdata Part #: | ATS-02F-80-C3-R0-ND |
| Manufacturer Part#: |
ATS-02F-80-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-80-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal energy can be an invaluable resource in a variety of applications, but it can also be dangerous and potentially damaging if not properly managed. Heat sinks are special devices that are designed to dissipate heat away from sensitive components and electronic circuits. The ATS-02F-80-C3-R0 is an advanced thermal heat sink designed to provide superior heat dissipation for cooling applications.
The ATS-02F-80-C3-R0 is a top-quality aluminum heat sink that is designed to provide maximum cooling efficiency for a wide range of applications. It is well-suited for use in tightly confined spaces, thanks to its small size and low profile design. It also utilizes an advanced mounting system to ensure it is securely installed in a variety of electronics enclosures. This heat sink is capable of handling high temperatures while also ensuring long term reliability and durability.
The ATS-02F-80-C3-R0 is engineered with an enhanced fin design and high-performance heat pipes to maximize cooling performance. The large surface area provided by the aluminum fins helps to effectively dissipate heat away from components, while the heat pipes allow for direct heat transfer from the component to the fins. This heat sink also features an aluminum base plate which helps to further reduce temperatures by acting as a thermal interface between the heat sink and the component.
The ATS-02F-80-C3-R0 is the perfect solution for a wide variety of thermal management applications. It is ideal for use in electronics products such as power supplies, servers, graphics cards, as well as a range of other electronics components. This advanced heat sink can help to ensure that components remain safe and reliable by dissipating damaging levels of heat away from critical components.
The ATS-02F-80-C3-R0 is a reliable, efficient, and cost-effective thermal heat sink that is perfect for any thermal management application. It features an optimized fin design and advanced heat pipes to deliver superior cooling performance and ensure peak performance for components. With its small size and low-profile design, this heat sink is perfect for use in tight spaces while its enhanced mounting system ensures secure installation. The ATS-02F-80-C3-R0 can provide reliable cooling for a wide range of components and applications, making it an ideal choice for your thermal management needs.
The specific data is subject to PDF, and the above content is for reference