| Allicdata Part #: | ATS-02F-89-C3-R0-ND |
| Manufacturer Part#: |
ATS-02F-89-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-89-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become an important task in today’s electronic devices, as heat generated from the system must be effectively dissipated in order to avoid damage. Heat sinks are one of the most commonly used cooling components to manage the heat generated by electronic devices. The ATS-02F-89-C3-R0 is a unique heat sink designed to provide effective heat dissipation for various electronic applications.
Construction and Design of ATS-02F-89-C3-R0
The ATS-02F-89-C3-R0 is a aluminum extruded heat sink designed with a distinctive fin shape. This fin design has a series of large and small protrusions, providing maximum contact area with the air, allowing for maximum heat dissipation. The fins rise above the base of the heat sink, forming a natural convection air flow over the fins, aiding in the process of heat dissipation. In addition, the ATS-02F-89-C3-R0 has a large surface area which allows for increased heat transfer.
Application Field of ATS-02F-89-C3-R0
The ATS-02F-89-C3-R0 is a versatile heat sink, allowing for efficient heat dissipation in a variety of applications. It is ideal for use in computers, servers, and other power electronic applications. The ATS-02F-89-C3-R0 is especially useful in high power applications, as its efficient design enables it to effectively dissipate large amounts of heat. In addition, the ATS-02F-89-C3-R0 is often used in applications that require low noise, as its aluminum fins allow for silent cooling without the need for a fan.
Working Principle of ATS-02F-89-C3-R0
The ATS-02F-89-C3-R0 works on the principle of natural convection. The fins of the heat sink, along with its large surface area, allow for maximum heat transfer from the system into the air. As hot air rises, the fins of the heat sink create an air flow over the fins, allowing for greater heat dissipation. In addition, the ATS-02F-89-C3-R0’s aluminium fins are able to transfer heat from the source to the atmosphere efficiently, reducing the temperature of the system quickly.
Conclusion
In conclusion, the ATS-02F-89-C3-R0 is an effective heat sink that is well suited for numerous electronic applications. Its unique fin design and large surface area enables efficient heat dissipation, while its quiet operation makes it ideal for low noise applications. The ATS-02F-89-C3-R0 is an ideal solution for managing the heat generated by electronic devices.
The specific data is subject to PDF, and the above content is for reference