ATS-02G-103-C1-R1 Allicdata Electronics
Allicdata Part #:

ATS-02G-103-C1-R1-ND

Manufacturer Part#:

ATS-02G-103-C1-R1

Price: $ 4.31
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X9.5MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02G-103-C1-R1 datasheetATS-02G-103-C1-R1 Datasheet/PDF
Quantity: 1000
10 +: $ 3.87513
30 +: $ 3.65967
50 +: $ 3.44434
100 +: $ 3.22906
250 +: $ 3.01379
500 +: $ 2.79852
1000 +: $ 2.74471
Stock 1000Can Ship Immediately
$ 4.31
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 27.64°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks have been widely used in our daily life. Of the various applications, one of the most commonly used is the ATS-02G-103-C1-R1 heat sink. It is the fanless thermal solution for low power electronic equipment. This article will explore the application field and working principle of the ATS-02G-103-C1-R1 heat sink.

The ATS-02G-103-C1-R1 heat sink is designed for applications where small fan noise is a concern, such as home appliances, medical equipment, computers and other electronic devices. It is also suitable for situations where minimum air flow is required, such as data centers, graphics cards, and game consoles. This heat sink is constructed using a dark gray aluminum alloy and is capable of dissipating heat efficiently and effectively at low noise levels. It features a sturdy built and is corrosion and impact resistant. It is able to handle a range of operating temperatures, from -20°C to 150°C.

The ATS-02G-103-C1-R1 heat sink works on the principle of heat conduction. That is, it is able to transfer heat from the heat source to the environment. Heat is dissipated through a series of fins connected with an adjoining base plate, which is made of a highly thermally conductive material such as aluminum or copper. It is important to note that the fins on the heat sink increases the surface area available for the dissipation of heat, thus dissipating heat much faster than the surface area of the heat source itself. In addition, the fanless design reduces the sound emissions significantly.

This heat sink also has an air bladder located at the top of the heat sink, which inflates when the temperature of the heat source reaches a certain limit. This helps to reduce the temperature of the heat source much faster than just relying on the fins alone. The air bladder can also be adjusted to allow for more efficient heat transfer while using less energy. The air bladder also reduces the levels of noise generated by the fanless design.

The ATS-02G-103-C1-R1 heat sink is also capable of dissipating heat from multiple heat sources at once. This feature has enabled the use of this product in many situations, such as in laptops and game consoles. With its proven ability to dissipate heat from multiple heat sources quickly and accurately, the ATS-02G-103-C1-R1 is the perfect solution for low power electronic equipment.

In conclusion, the ATS-02G-103-C1-R1 heat sink is an ideal product for applications where minimal fan noise is a concern, or when minimum air flow is required. Its fanless design makes it a great choice for low power electronic equipment. Utilizing the principles of heat conduction, the fans on the heat sink highly efficient heatsink, and air bladder provide efficient and effective heat dissipation for multiple heat sources. With its high performance and excellent cost-effectiveness, the ATS-02G-103-C1-R1 heat sink is the perfect solution for any application.

The specific data is subject to PDF, and the above content is for reference

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