| Allicdata Part #: | ATS-02G-114-C1-R0-ND |
| Manufacturer Part#: |
ATS-02G-114-C1-R0 |
| Price: | $ 3.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02G-114-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.86524 |
| 30 +: | $ 2.78754 |
| 50 +: | $ 2.63277 |
| 100 +: | $ 2.47785 |
| 250 +: | $ 2.32301 |
| 500 +: | $ 2.24557 |
| 1000 +: | $ 2.01326 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.38°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-02G-114-C1-R0 is a type of heat sink designed to efficiently dissipate large amounts of heat generated by electronic components. Heat sinks are devices that use thermal conductors to move the heat away from the component to a more suitable air or liquid medium, such as air or water. Targets and limits for the thermal design of the ATS-02G-114-C1-R0 are set to ensure that the component operates efficiently over its intended application.
Application Field
The ATS-02G-114-C1-R0 is primarily intended for use in high-end industrial control applications. This heat sink is designed to be used in applications requiring high levels of thermal conductivity, such as those involving high-power electrical components. This includes high-end industrial equipment, such as motor drives, servo drives, programmable logic controllers, frequency inverters, power transistors, and other industrial applications.
Working Principle
The ATS-02G-114-C1-R0 dissipates large amounts of heat away from the component and into the surrounding environment. It does this by using the thermal conductors within its heat pipes. Heat pipes are designed to transfer heat into a liquid medium, which is then moved to a larger ablative surface. Heat is then dissipated away from the heat sink using air cooling or liquid cooling.
The heat sink is designed to keep the temperature of the component within a certain range. The range is set based on the thermal design of the heat sink and is typically within 5 to 8 degrees Celsius. This ensures that the component operates within its rated operating temperature range and prevents it from overheating.
The ATS-02G-114-C1-R0 is also designed to provide a high level of thermal conductivity. Its thermal conduction is higher than traditional aluminum-based heat sinks, and it is also designed to offer superior thermal dissipation. This makes it suitable for use in high-power applications where large levels of heat can be generated.
Conclusion
The ATS-02G-114-C1-R0 is a high-performance heat sink designed for use in high-end industrial control applications. It is designed to dissipate large amounts of heat away from the component and into the surrounding environment, while also providing a high level of thermal conductivity. It is suitable for use in applications requiring high levels of thermal performance, such as those involving high-power electrical components.
The specific data is subject to PDF, and the above content is for reference