ATS-02G-133-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-02G-133-C3-R0

Thermal management is a key factor in the design and production of any electronic device. Heat sinks are important components of any thermal management system and the ATS-02G-133-C3-R0 is a unique thermal heat sink from Advanced Thermal Solutions, Inc. (ATS). This heat sink is designed to handle high thermal loads while at the same time remaining low profile. It has a variety of applications in the electronics, medical, aerospace, military, and industrial industries.

Application Field and Working Principle

The ATS-02G-133-C3-R0 is designed for cooling and thermal management of high powered components such as CPUs, GPUs, FPGAs, MEMs devices, power transistors, and lasers. It is designed to be low profile yet able to effectively handle high thermal loads. The ATS-02G-133-C3-R0 features a built-in heat spreader base and an efficient heat sink design that can dissipate heat quickly and evenly. The ATS-02G-133-C3-R0 uses heat pipe technology to achieve high cooling performance. This technology works by using a liquid to pass heat from one location to another. The heat pipes contain a sealed liquid coolant, which is circulated through the heat pipe by capillary action. The liquid absorbs heat from the source and is transported to the heat sink, where the heat is then dissipated. This heat dissipation process helps maintain a low temperature on the heat source and protects it from thermal damage.The ATS-02G-133-C3-R0 is a low profiled, cost effective thermal solution. It is specifically designed for applications that require a small form factor, such as mobile phones, tablets, and other portable electronic devices. It is constructed using high-grade aluminum, anodized for superior thermal conductivity, and is designed to fit tight spaces. The heat sink can be easily attached to the device with a clip-on fan or a mounting kit, making it a convenient and highly efficient thermal solution.

Features

The ATS-02G-133-C3-R0 has a number of features that make it an attractive thermal solution. Its low profile design allows it to fit in tight spaces and its heat dissipation capabilities make it a high performance cooling solution. The heat sink is designed with an optimized fin arrangement and profile to maximize air flow and ensure efficient heat transfer. It has a maximum operating temperature range of 0 to 100°C and it is vibration resistant. It has an excellent corrosion resistance, which is ideal for use in extreme environmental conditions.The ATS-02G-133-C3-R0 is a rugged and durable thermal solution. It is designed for long life and to provide reliable cooling and thermal management. It is also RoHS compliant, making it an excellent choice for environmentally conscious consumers.

Conclusion

The ATS-02G-133-C3-R0 is a unique and versatile thermal heat sink. It is designed for cooling and thermal management of high powered components such as CPUs, GPUs, FPGAs, MEMs devices, power transistors, and lasers. It is a low profile and cost effective thermal solution and is ideal for use in mobile phones, tablets, and other portable electronic devices. The ATS-02G-133-C3-R0 has an excellent performance and is designed for long life and reliable cooling and thermal management. It is a rugged and durable solution that is RoHS compliant and suitable for a variety of applications.

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