| Allicdata Part #: | ATS-02G-140-C3-R0-ND |
| Manufacturer Part#: |
ATS-02G-140-C3-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02G-140-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-02G-140-C3-R0 is a highly advanced thermal heat sink ideal for dissipating heat from a range of electronic components. It is a versatile product that can be used for a variety of purposes ranging from cooling high-powered processors and GPUs to stabilizing temperatures in smaller devices such as laptops.
The ATS-02G-140-C3-R0 is comprised of an aluminum alloy aluminum alloy base plate and three heat sink fins. The base plate is designed to be lightweight yet rigid, allowing for a large surface area to dissipate heat evenly. The fins are placed in a vertical configuration, which increases the amount of heat that can be dissipated from the surface of the base plate. On top of the fins, there is a layer of aluminum oxide coating, which further increases the thermal performance of the ATS-02G-140-C3-R0.
When in operation, the ATS-02G-140-C3-R0 operates by dissipating the heat generated from the component to the surrounding air or liquid via conduction and convection. The heat generated from the component is transferred via a thermal interface material which is contained between the component and the base plate. This thermal interface material helps to ensure that a uniform temperature is maintained between the component and the base plate, thus allowing for more efficient heat transfer.
The conduction phenomenon occurs when the heated air from the component transfers heat to the aluminum base plate, which then dissipates the heat to the surrounding air or liquid. The convection phenomenon occurs when the heated air from the component rises, carrying the heated particles up the fins, allowing them to disperse and dissipate the heat into the surrounding air or liquid.
The ATS-02G-140-C3-R0 is designed to accommodate components of varying sizes and shapes including CPUs, GPUs, FPGAs, and other digital integrated circuits. It is an effective solution for cooling components in high-power computers and electronics. It can also be used for cooling other high-performance components such as LEDs, battery cells, and sensors.
The ATS-02G-140-C3-R0 is easy to install and offers the perfect solution for those who require effective thermal management solutions in their applications. It is designed to maximize thermal performance while keeping the weight minute and the size small. It provides reliable, efficient, and cost-effective cooling solutions for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference