ATS-02G-181-C3-R0

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A thermal heat sink, also sometimes called an active cooling component, is a device that helps dissipate or regulate the amount of heat generated by an integrated circuit, power component, or other electronic device. The ATS-02G-181-C3-R0 is a type of thermal heat sink specifically designed for the application of cooling high power components and integrated circuits. It is an economical solution to reduce the thermal resistance of the devices it is used with, resulting in improved performance and system reliability.

The ATS-02G-181-C3-R0 is a 3-fin heat sink made of high thermal conductivity extruded aluminum that is designed to be used in combination with a heatsink fan in systems with a small form factor. It has an eighth-inch thick copper base that is ideal for efficient heat dissipation. Furthermore, it provides good surface area for efficient cooling along with a strong mechanical set-up for larger components. In addition, this heat sink provides an estimated thermal resistance of 0.14℃cm²/W, or 50°C/W.

The ATS-02G-181-C3-R0 is designed to be suitable for use in applications that require effective and efficient thermal management. In such cases, this thermal heat sink\'s extensive radiating area maximizes the dissipation of heat away from the heat-generating components, resulting in improved reliability and performance. Additionally, this device is designed to work with the most common types of systems, including DIP, SIP, and SOIC. The low profile of this device also makes it compatible with applications where space is an issue.

In terms of its working principles, the ATS-02G-181-C3-R0 is designed to transfer thermal energy from one conductive surface to another, typically from an integrated circuit or power component to the ambient air. Heat is generated within a system due to the electric power consumption of components, and it is important to effectively dissipate the heat away to reduce temperatures and the overall power consumption of the system. The ATS-02G-181-C3-R0 assists with this process by conducting heat away from the component and dissipating it through the radiator fins.

The design of the ATS-02G-181-C3-R0 also includes features to minimize air turbulence, which further increases the thermal dissipation process. Furthermore, this device is designed with contact surfaces optimized for ultimate performance, helping to increase the contact area between the heat sink and the component, resulting in more efficient heat conduction and dissipation. When used correctly, the ATS-02G-181-C3-R0 can help operational temperatures stay within the optimal temperature range and reduce the power consumption of the system.

The ATS-02G-181-C3-R0 is an effective and efficient thermal heat sink that is designed for the cooling of high power components and integrated circuits. It is an economical solution that is suitable for use in a variety of systems and applications, due to its low profile design and extensive radiating area. Additionally, its optimized contact surfaces help to optimize the process of transferring thermal energy away from components, resulting in lower temperatures and improved system reliability.

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