
Allicdata Part #: | ATS-02G-191-C3-R0-ND |
Manufacturer Part#: |
ATS-02G-191-C3-R0 |
Price: | $ 4.61 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X30MM R-TAB T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.15233 |
30 +: | $ 3.92175 |
50 +: | $ 3.69104 |
100 +: | $ 3.46040 |
250 +: | $ 3.22971 |
500 +: | $ 2.99902 |
1000 +: | $ 2.94134 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.181" (30.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 2.99°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are devices that are used to dissipate heat and are typically made of aluminum or other metals that have a high thermal conductivity. The ATS-02G-191-C3-R0 is a special type of heat sink that is designed to dissipate heat in electronic and electrical applications where the component temperatures may exceed the thermal limits of standard heat sinks.
The ATS-02G-191-C3-R0 thermosink is a two-piece device composed of a copper core, glass-filled polyamide, and an aluminum box combination for heat dissipation. The copper core of the ATS-02G-191-C3-R0 consists of a copper upper and lower thermal spreader, a copper enclosed fin area, and four copper and aluminum panels. This copper core acts as a heat exchanger to efficiently transfer heat from the component or system to the fin area where it can be dissipated by natural convection air flow. The aluminum box houses the copper core while providing a protective outer shell.
The ATS-02G-191-C3-R0 thermosink has several unique features including: a made to order design, a choice of two aluminum box sizes, and the ability to select the number of copper and aluminum panels to meet performance requirements. Furthermore, a unique feature of the ATS-02G-191-C3-R0 thermosink is its ability to be used as a sealed system to help reduce acoustic noise. This is achieved by using the included screw and gasket to construct a sealed system.
The ATS-02G-191-C3-R0 can be used in many thermal management applications. Examples include LED lighting systems, high power amplifiers, power supplies, electric motors, consumer electronics and high voltages circuits. It can also be used to cool PCBs that are exposed to high ambient temperatures. The ATS-02G-191-C3-R0 is designed to dissipate heat quickly and efficiently at temperatures between -40°C and +60°C. The ATS-02G-191-C3-R0 is best suited for applications where it is necessary to dissipate heat generated from high power components in a short amount of time.
The working principle of the ATS-02G-191-C3-R0 is based on the natural convection air flow of rising warm air and cooler lower air. The warm air is drawn in by the enclosing walls of the aluminum box and then rises as the copper core transfers heat to the fins. As the warm air rises, it passes through the fins and dissipates the heat into the atmosphere, cooling the copper core and component. This natural convection process allows for the efficient transfer and dissipation of heat at temperatures below the maximum ambient temperature.
The ATS-02G-191-C3-R0 has been designed to provide excellent thermal performance while maintaining a low profile, making it ideal for applications with space constraints. The patented design uses high quality components to ensure a reliable and efficient cooling system. With a performance temperature range of -40°C and +60°C, the ATS-02G-191-C3-R0 is ready for use in a wide range of thermal management situations.
The specific data is subject to PDF, and the above content is for reference