| Allicdata Part #: | ATS-02G-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-02G-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02G-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks use conduction, convection, and often radiation to transfer thermal energy away from components and other heat-sensitive materials. One of the most common applications of heat sinks is that they are often used in conjunction with high power semiconductor devices, such as transistors, integrated circuits and microprocessors, to keep them from overheating and damaging. The ATS-02G-20-C1-R0 is an advanced industrial grade heat sink technology from V8 Technologies, designed for use in extreme applications.
The ATS-02G-20-C1-R0 uses a unique combination of heat transfer methods to provide efficient and reliable thermal management. The device features both a high performance thermal compound for maximumheat transfer efficiency and a saw-toothed aluminum alloy base for superior heat dissipation. The aluminum alloy is anodized to improve durability and to prevent corrosion. Additionally, the ATS-02G-20-C1-R0 has an internal cooling fan to further improve heat dissipation.
The ATS-02G-20-C1-R0 is designed for industrial applications and can efficiently dissipate heat from electrical devices such as motors, circuit breakers, and high-power photovoltaic inverters. The device provides a superior thermal performance with its high-performance thermal film and saw-toothed base. The large surface area of the heat sink allows for a greater capacity for heat dissipation while the anodized aluminum fin structure provides superior mechanical strength.
The ATS-02G-20-C1-R0 also features a built-in temperature sensor, which monitors the temperature of the device and allows for precise control over the thermal management of the system. This feature is very useful in automated thermal management systems or in applications where the device is required to maintain a specific temperature. The cooling fan is adjustable to allow for different cooling requirements.
The ATS-02G-20-C1-R0 is designed to be easy to use and to provide a high level of reliability. It features an IP-67 rated enclosure and is resistant to dust, water, and vibration. The device is also UL approved and is RoHS compliant. The device can also be customized with artwork to provide a unique look.
The ATS-02G-20-C1-R0 is ideal for industrial applications that require reliable and efficient thermal management. It provides superior performance and excellent durability. The device is an excellent choice for applications where high-power semiconductor devices require a highly efficient heat sink to keep them from overheating. This device is an ideal solution for industrial and commercial applications.
The specific data is subject to PDF, and the above content is for reference