ATS-02G-20-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks

Thermal-Heat Sinks are an integral part of managing heat in electronic devices. Convection, Heat Pipes, Compact Heat Sinks or Regular Heat Sinks are used in all areas including consumer electronics.To understand why they are necessary for ATS-02G-20-C3-R0 applications it is important to understand the basics of how heat sinks work. Heat sinks are designed to help dissipate heat from small electronic components. They do this by capturing and trapping heat that is generated by devices and transferring it away from the device\'s sensitive components.

The Working Principle of ATS-02G-20-C3-R0

ATS-02G-20-C3-R0 is a type of Heat Sink specifically designed to fit Heatsink Packages with a 0.18" pitch. This feature allows for easy installation and operation of the heat sink. This Heat Sink utilizes a Heat Pipe construction technique. Heat Pipe technology enables efficient and reliable heat dissipation. Heat Pipes absorb the heat from the surrounding air and transfer it away from the device components.Heat Pipe technology enables the effective transfer of heat between multiple sources. This efficient heat transfer enables the components to remain at a safe temperature even when exposed to intensive cooling requirements or extreme working conditions.In addition, the ATS-02G-20-C3-R0 is fitted with Micro Groove Technology for increased thermal capacity and increased heat transfer rates. This helps to ensure that the device can operate consistently without any heat issues.

Application Field of ATS-02G-20-C3-R0

The ATS-02G-20-C3-R0 is an ideal solution for applications where the cooling component is a critical issue.The Micro Groove technology of this heat sink makes it perfect for high-performance applications such as gaming PCs and overclocking. Its unique ability to transfer a large portion of the heat generated from the device enables these types of machines to remain running without any issues caused by excessive heat.The ATS-02G-20-C3-R0 is also perfect for applications that require a high thermal capacity, such as aerospace, automotive, military, and medical applications. The large thermal capacity of the heat sink combined with Heat Pipe technology ensures that these types of applications can operate efficiently without any issues caused by excessive heat. In addition, this heat sink is ideally suited for customizations because of its low profile design. This enables users to customize their system to fit their specific needs.

Conclusion

ATS-02G-20-C3-R0 is a Heat Sink designed to fit Heatsink Packages with a 0.18" pitch. This Heat Sink utilizes Heat Pipe technology to dissipate heat more efficiently and with greater stability. The ATS-02G-20-C3-R0 is an ideal solution for applications where cooling is a critical issue due to its large thermal capacity and heat transfer rates. It is suitable for applications such as gaming PCs, overclocking, aerospace, automotive, military, and medical applications due to its effective heat transfer capabilities and low profile design.

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