ATS-02G-200-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.90°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are used to dissipate the heat generated by the operation of electrical components or systems. In the electronics industry, they are most commonly used for cooling CPUs, GPUs, hard drives and other components that require a constant temperature for optimal performance. The ATS-02G-200-C3-R0 is one such heat sink that is designed specifically for cooling down electronic components.The ATS-02G-200-C3-R0 is a compact heat sink that is designed to be mounted directly on top of an electronic component to provide an efficient heat dissipation solution. This heat sink has been designed to provide a highly effective cooling system for a wide variety of applications. It is constructed from high-grade aluminum alloy with an anodized black finish and can operate with temperatures ranging from –60°C to +125°C.The ATS-02G-200-C3-R0 has a slim profile that fits perfectly onto motherboards, power supplies, memory modules and even removable hard drives. The maximum speed at which it can operate is 2000 RPM, and it can achieve an airflow of up to 60 CFM. The fan at the heat sink’s core is designed for a low-noise operation, allowing for silent cooling. In terms of application fields, the ATS-02G-200-C3-R0 is most commonly found in desktop PCs, laptops, and servers, as well as industrial and medical equipment. This heat sink is also highly suited for cooling down electromechanical systems, such as pumps, engines, motors, and other components that generate heat. In addition to these applications, the ATS-02G-200-C3-R0 can be used to cool factory automation systems, industrial controllers and many other electronics devices.To understand how the ATS-02G-200-C3-R0 works, it is essential to understand the principle of heat transfer. Heat transfer occurs when heat from one source is transferred to another. In the case of the ATS-02G-200-C3-R0, heat generated by the electronic components is transferred to the heat sink, which then dissipates it into the environment. The heat sink consists of an aluminium base and fins, which are responsible for creating an efficient heat transfer path between the electronic device and the ambient environment. The fan is used to draw cool air into the heat sink and force hot air out the other side, thus regulating the temperature of the electronic components. In addition to the fan, the base of the heatsink also works to disperse excess heat.Overall, the ATS-02G-200-C3-R0 is an excellent heat sink and provides efficient cooling for a wide range of applications. It has a slim profile that fits onto many different types of circuit boards and components, allowing for easy installation. Its efficient fan and aluminium base ensure that heat generated by the electronic device can be quickly and effectively dissipated.

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