ATS-02G-204-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.54°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The Thermal – Heat Sinks ATS-02G-204-C3-R0 is a device used to transfer heat from one source to another in order to maintain the optimal temperature. It is a passive component consisting of a thermally conductive material, such as aluminum, copper, or the like, which is attached to a heat source. The thermal – heat sink then works by using its surface area to dissipate heat from the source into its surroundings, usually in the form of convection, radiation, or both.

Application Field

Thermal – heat sink ATS-02G-204-C3-R0 is commonly used in consumer electronics, such as laptops and computers, as well as in various industrial applications and even in the aerospace industry. It is also found in automotive, aerospace, medical, and defense applications. As such, thermal – heat sinks are invaluable components for dissipating high amounts of heat from power components, such as processors, ASICs, GPUs, and transistors.

Working Principle

Thermal – heat sinks ATS-02G-204-C3-R0 work by transferring thermal energy from a hot source, such as a processor, to a cooler medium, usually air. The heatsink is made of a thermally conductive material that absorbs heat from the source and dissipates it to the surrounding environment. The thermal energy is then transferred to the cooler medium either through convection or radiation.Convection is the process of moving the cool air up and away from the heatsink and into the surrounding environment, thus absorbing the heat from the source. This method is more efficient than radiation since it requires no ambient air temperature for heat transfer. Radiation, on the other hand, involves emitting heat from the source in the form of infrared rays that travel through the air and dissipate into the surrounding environment. This method of heat transfer is limited by the ambient air temperature.In order for the thermal – heat sinks ATS-02G-204-C3-R0 to be effective, they must feature well-designed fins that provide a large surface area to increase convection and minimize air resistance. The fins also cause the air to flow over the heatsink evenly, which increases the efficiency of the dissipating of heat. Additionally, some heat sinks include forced convection, which is the use of fans to generate an airflow and speed up the heat transfer.

Conclusion

Thermal – heat sinks ATS-02G-204-C3-R0 provide effective and efficient heat dissipation in a variety of applications such as consumer electronics, electronics, automotive, aerospace, medical and defense. By means of convection and/or radiation, it removes thermal energy from the source and dissipates it in the surrounding environment. Advanced designs of these thermal – heat sinks involve the use of fins to increase the surface area and improve airflow over the device. Forced convection can also be present to speed up the heat transfer. All of these design features come together to create an effective and efficient cooling solution.

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