| Allicdata Part #: | ATS-02G-23-C1-R0-ND |
| Manufacturer Part#: |
ATS-02G-23-C1-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02G-23-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.81717 |
| 30 +: | $ 3.60507 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-02G-23-C1-R0 thermal heat sink is a type of heat removal device that is designed for efficient energy transfer. With its unique design and advanced technology, it can provide an effective solution to many of the issues related to thermal management in electronic and other applications.
Heat sinks are commonly used in computers and other electronic devices to dissipate the heat generated by these devices. Heat sinks are used to disperse the heat away from the device and into the surrounding environment by using the convection and conduction processes. By doing so, the device is prevented from becoming too hot to operate and risk causing damage to its components or failing to function properly.
The ATS-02G-23-C1-R0 thermal heat sink is a high performance, highly efficient heat sink designed for full life performance. This type of heat sink is made from aluminum and can be used in a variety of applications including servers, computers, laptops, and other electronic devices. It is designed to provide fast and reliable cooling of components, while providing the utmost in compatibility and thermal performance.
This heat sink is a two-part design, with a base plate and a heat spreader. The base plate is made from aluminum and has a thick thermal pad that absorbs the heat generated. The aluminum base is much larger and thicker than regular metal bases, which makes it an excellent choice for dissipating heat because of its high thermal conductivity. The heat spreader is then attached to the aluminum base and provides increased surface area for heat dissipation. The spreader also features a unique circular shape that helps in directing the heat away from the device.
The ATS-02G-23-C1-R0 thermal heat sink is designed with a low-coefficient of friction, which means that it can dissipate heat more efficiently than some other types of heat sinks. It also takes advantage of the air flow that passes around the device in order to effectively cool off the device without using a fan. Furthermore, the heat sink is also designed to reduce the noise produced from the device by dampening and muffling the noise. This makes it perfect for use in quiet environments.
The ATS-02G-23-C1-R0 thermal heat sink is an excellent choice for any application looking to maintain high thermal performance. It is designed for efficient heat transfer and optimal performance, making it the perfect choice for demanding applications. With its high thermal conductivity and efficient heat transfer technology, this heat sink will ensure that your electronic device, computer, or server will function at peak performance.
The ATS-02G-23-C1-R0 thermal heat sink is a reliable, high-performance heat sink, designed for full life performance. It offers high thermal performance and compatibility and is an ideal choice for applications seeking to maintain high thermal performance. The high-efficiency design of the heat sink makes it an excellent choice for any application looking to dissipate heat efficiently and reliably.
The specific data is subject to PDF, and the above content is for reference