| Allicdata Part #: | ATS-02G-25-C1-R0-ND |
| Manufacturer Part#: |
ATS-02G-25-C1-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02G-25-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.32621 |
| 30 +: | $ 4.08555 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions have become an integral part of the modern electronic manufacturing process. Heat Sinks, such as ATS-02G-25-C1-R0, are used to dissipate the heat generated by the circuit components, allowing manufacturers to deliver products that meet the necessary performance levels while keeping their components safe from any potential damage caused by excess heat.
The ATS-02G-25-C1-R0 is a heat sink designed to dissipate the generated heat in order to achieve a point of equilibrium between the heat produced and the air flow around the circuit. The heatsink comprises of two main components, a baseplate and a fan. The baseplate is the primary element of the heat sink; its shape and size determine the proportions of air intake and discharge. The fan then helps to increase the flow of air over the baseplate, thus improving thermal efficiency.
The ATS-02G-25-C1-R0 was designed to provide a solution for applications with limited space, such as processors and graphics cards, and other components which generate high levels of heat. Its unique design and structure work together to maximum effect; the fan is strategically positioned to draw air from the bottom and expel it out of the top; and the heat from the component is intercepted by the fins of the baseplate where it is then dissipated into the air.
To ensure that the ATS-02G-25-C1-R0 is effective, it is important to consider the application field in order to determine the necessary level of air flow and thermal efficiency. The size of the component being cooled, the operating environment and the amount of airflow required are all contributing factors which need to be taken into consideration when selecting a heat sink suitable for the task. Furthermore, the ATS-02G-25-C1-R0 needs to be installed in the correct orientation in order for it to work efficiently, with the fan facing the heat source.
In general, the ATS-02G-25-C1-R0 is suitable for use in various industrial applications, including computers, servers, audio-visual equipment and telecommunications. In addition to maintaining the optimal temperature of these components, the ATS-02G-25-C1-R0 also provides improved safety and reliability. Moreover, due to its compact size, it can be installed in tight spaces without compromising the thermal efficiency of the device.
In conclusion, the ATS-02G-25-C1-R0 is a highly efficient and reliable heat sink which can be used to dissipate the heat generated by various components. Its unique design and structure allow it to maintain optimal thermal efficiency in limited spaces, ensuring that all components operate at the desired level. The ATS-02G-25-C1-R0 also offers improved safety and reliability with its efficient cooling system, making it perfect for various industrial applications.
The specific data is subject to PDF, and the above content is for reference