ATS-02G-27-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.23°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-02G-27-C1-R0 Thermal - Heat Sinks

The ATS-02G-27-C1-R0 is a type of thermal - heat sink that is designed to dissipate heat away from electrical, electronic and other types of hardware. It is typically used when thermal management products of any size do not provide sufficient cooling. This type of heat sink can be found in many electronic products such as computer systems, consumer electronics, industrial machinery, and automotive applications.The ATS-02G-27-C1-R0 is constructed with base and fin assemblies. The base is usually constructed from either aluminum or copper though other materials are sometimes used. The fins are made of aluminum and are designed to provide the maximum surface area for transferring heat away from the component. The fins are spaced evenly so that the air can circulate between them and accelerate the heat transfer process.The working principle of the ATS-02G-27-C1-R0 is the same as any other heat sink: to dissipate heat away from a component or device. Heat is transferred away from the component and into the fins of the heat sink. The air then circulates around the fins and carries the heat away from the component. The thermodynamics of this system is based on a physical principle known as convection. Convection is the transfer of heat from one material to another by the movement of air or liquid.The ATS-02G-27-C1-R0 is an effective heat sink in applications where heat needs to be removed or transferred away from a component or device. This type of thermal - heat sink is used in a variety of applications such as computing, consumer electronics, industrial machinery, and automotive applications. It is especially useful in applications where space is limited and heat needs to be removed quickly and efficiently.The ATS-02G-27-C1-R0 is designed to be highly efficient and reliable in its heat dissipation abilities. It is built of durable materials and is designed to withstand the rigors of the environment in which it will be used. It is also designed to maintain its integrity over time as it is subjected to the elements.The ATS-02G-27-C1-R0 is designed to provide the best possible heat dissipation performance in small to medium-sized components and devices. It is also designed to be highly economical and to provide maximum value for money. It is a highly cost-effective solution for those who need to quickly and efficiently remove heat from their electronic products and systems.In addition to being highly efficient, the ATS-02G-27-C1-R0 is also designed to be extremely reliable and easy to install. It can be quickly and easily mounted to most electronic components and devices. This makes it a great choice for those who need to quickly and conveniently install a reliable and efficient thermal - heat sink without breaking the bank.Overall, the ATS-02G-27-C1-R0 is an excellent choice for those who need an efficient and reliable thermal management product to quickly and efficiently remove heat from their components and devices. It is designed to be highly efficient, reliable, and economical, making it a great value for those who need a simple and effective heat sink solution.

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