ATS-02G-37-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02G-37-C1-R0-ND

Manufacturer Part#:

ATS-02G-37-C1-R0

Price: $ 5.43
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 36.83X57.6X17.78MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02G-37-C1-R0 datasheetATS-02G-37-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.88124
30 +: $ 4.60992
50 +: $ 4.33881
100 +: $ 4.06766
250 +: $ 3.79648
500 +: $ 3.52531
1000 +: $ 3.45751
Stock 1000Can Ship Immediately
$ 5.43
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 2.267" (57.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.700" (17.78mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are a highly efficient cooling solution for use in electronics. The main purpose of a heat sink is to increase the rate of heat transfer by dispersing heat from hot components. The ATI ATS-02G-37-C1-R0 is a high performance thermal heat sink that is designed for a wide variety of cooling applications. This heat sink provides an optimal thermal performance due to its advanced multi-layer composite aluminum core.

This heat sink is designed to fit into a small form factor(SFF) application. It is constructed from a lightweight aluminum alloy for superior heat transfer with excellent thermal characteristics. This heat sink utilizes the proper airflow design which maximizes the cooling power of the sink. The combination of its compact size and advanced material make it the ideal choice for applications such as cooling components in computers, medical equipment, and other electronic devices.

ATS-02G-37-C1-R0 Application Field and Working Principle

The ATS-02G-37-C1-R0 heat sink is ideal for use in applications where low noise requirements are necessary. It is designed to be in direct contact with the heat source, allowing the most efficient heat transfer possible. The aluminum alloy construction helps to dissipate heat from the heat source quickly and effectively. The heat sink offers a wide variety of mounting options, including both standard and custom configurations.

The working principle of the heat sink is that a sizeable area is created in order to absorb and spread the heat away from the device. The heat is absorbed by aluminum through a process known as conduction and then dissipated to the surrounding area via convection. This helps to reduce the overall temperature around the device and prevents it from becoming too hot. As the heat is dissipated into the air, it also helps to reduce the overall power consumption of the device.

The ATS-02G-37-C1-R0 heat sink features a high thermal conductivity and efficient heat transfer, making it an ideal choice for a wide range of cooling applications. The heat sink also offers excellent thermal management through its advanced aluminum construction. With the combination of its small size and high performance, this heat sink is the perfect solution for any cooling situation.

The specific data is subject to PDF, and the above content is for reference

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