| Allicdata Part #: | ATS-02G-48-C1-R0-ND |
| Manufacturer Part#: |
ATS-02G-48-C1-R0 |
| Price: | $ 3.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02G-48-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.36420 |
| 30 +: | $ 3.27348 |
| 50 +: | $ 3.09154 |
| 100 +: | $ 2.90972 |
| 250 +: | $ 2.72785 |
| 500 +: | $ 2.63691 |
| 1000 +: | $ 2.36412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-02G-48-C1-R0 is a thermal-heat sink designed to provide effective heat dissipation for electronic devices. The heat sink is optimized to provide thermal performance and minimize thermal resistance between the device and ambient environment. The thermal-heat sink also helps to ensure reliable and long-term operation of the devices.
Construction
The ATS-02G-48-C1-R0 is constructed with a top cover that is formed from aluminum, and a base plate made of either aluminum or copper. The thermal compound is injected between the top cover and base plate to provide superior thermal contact and eliminate air gaps. The heat sink also features a fin angle that allows for greater heat dissipation and a better thermal transfer.
Design Features
The ATS-02G-48-C1-R0 features a unique design that enables efficient thermal performance and higher heat dissipation. The top cover and base plate are designed with a smooth surface to increase heat dissipation. The fin angle of the heat sink helps to produce higher thermal efficiency. The heat sink also offers multiple mounting options, which helps to make installation easier and faster.
Applications
The ATS-02G-48-C1-R0 thermal-heat sink is designed for use in applications such as microprocessors, power transistors, integrated circuits, and other hot spots or power electronic components. The heat sink is also used in LED lighting, automotive electronics, and LCD displays. The ATS-02G-48-C1-R0 is ideal for applications where low conductivity and low thermal resistance are required.
Working Principle
The ATS-02G-48-C1-R0 functions by using natural convection to dissipate the heat generated by the devices that it is connected to. This helps to keep the electronic components cool and prevents them from overheating. When air passes through the fins of the heat sink, it absorbs the heat and circulates it away from the device, allowing for better thermal performance and reduced thermal resistance. The heat sink also helps to maintain a low temperature for the device, thereby improving its operation.
Advantages
The ATS-02G-48-C1-R0 offers several advantages over traditional cooling systems. It is lightweight, making it easy to install and transport, and it requires minimal maintenance. The heat sink also has a high thermal performance and low thermal resistance, which enhances the efficiency of the device. Additionally, the heat sink is cost-effective, making it a great choice for budget-conscious users.
The specific data is subject to PDF, and the above content is for reference