ATS-02G-49-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Thermal management is one of the most important aspects of modern electronic and thermal devices, and heat sinks are essential components for managing the dissipated energy from these components. The ATS-02G-49-C1-R0 is a specialized heat sink designed to disperse heat from the processing core of a wide range of electronic devices. In this article, we will look at the application and working principles of the ATS-02G-49-C1-R0.

Application

The ATS-02G-49-C1-R0 is designed for use with a range of electronic devices. It is particularly suitable for devices that incorporate a non-within-package thermal transfer module, such as those that make use of microprocessors and other heat-generating components. The heat sink is constructed with extruded aluminum and is capable of dissipating up to 49 watts of heat, which makes it suitable for use in a range of industrial applications.

The ATS-02G-49-C1-R0 is designed for use in environments with temperatures up to 125°F (51.7°C). It has a dielectric strength of 6kV and is capable of withstanding high vibrations. The base of the heat sink is made from copper, which increases its thermal conductivity and improves its ability to transfer heat quickly and efficiently.

The ATS-02G-49-C1-R0 is also designed to reduce the acoustic and electromagnetic interference generated by the device it is cooling. This makes it ideal for use in a variety of noise-sensitive applications. In addition, the heat sink is designed to be energy efficient and is certified to the Underwriters Laboratories (UL) standard for safe operation.

Working Principle

The ATS-02G-49-C1-R0 is a passive heat sink, meaning it does not actively produce a cooling effect. Instead, it relies on the natural process of conduction to move heat away from the device it is cooling. The extruded aluminum body of the ATS-02G-49-C1-R0 absorbs and distributes the heat from the device, which is then moved away from the device via a combination of convection and radiation.

The thermo-electric properties of the copper base allow it to act as a thermal barrier and efficiently transfer heat away from the device. The base is specifically designed to transfer heat from the device without inhibiting its performance. This reduces energy consumption and helps to prolong the lifespan of the device.

The ATS-02G-49-C1-R0 also incorporates a ‘fins’ structure which helps to increase the surface area for heat dissipation. This further increases the cooling efficiency of the heat sink, ensuring the device is able to run at its optimal performance.

Conclusion

The ATS-02G-49-C1-R0 is an effective and efficient heat sink, designed to dissipate the heat generated by modern electronic devices. Its extruded aluminum body and copper base make it suitable for a wide range of applications, while its ‘fins’ structure ensures it is able to heat efficiently from the device it is cooling. By managing the energy dissipation of an electronic device, the ATS-02G-49-C1-R0 helps to improve the device’s energy efficiency and prolong its lifespan.

The specific data is subject to PDF, and the above content is for reference