| Allicdata Part #: | ATS-02G-55-C1-R0-ND |
| Manufacturer Part#: |
ATS-02G-55-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02G-55-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 23.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-02G-55-C1-R0 is a type of thermal - heat sink designed to carry heat away from components and keep them at a safe temperature. It is primarily used to dissipate the heat produced by high power electronic components and dissipate the generated heat to the ambient environment efficiently. It is widely used in power electronic devices like motor drivers, power supplies, heavy duty power supplies, and AC/DC converters.
A thermal - heat sink is a relatively simple component with an ingenious design. A thermal - heat sink consists of an array of fins that serve as conductors of heat. A fin is a thin, flat piece of aluminum that is placed on top of a heat source such as a power transistor. The fins act as individual radiators, carrying the heat away from the heat source and dissipating it into the surrounding air. The design of the fins is such that the air current created by their movement will also dissipate some of the heat into the surrounding air.
The ATS-02G-55-C1-R0 thermal - heat sink is designed to be used in applications with power transistors that operate at currents up to 10A. The heat generated by such components is directed away from them by the fins and dissipated to the surroundings by convection. The fins are arranged in a geometric pattern that allows for maximum surface area which in turn ensures maximum heat transfer. The fins are made of aluminum which is an excellent conductor of heat and is lightweight.
In addition to the fins, ATS-02G-55-C1-R0 thermal - heat sink also utilizes a copper base for heat transfer. The copper base allows for faster thermal transfer from the heat source to the fins. The copper base is also much stronger than aluminum and is able to withstand higher temperatures. The design of the ATS-02G-55-C1-R0 thermal - heat sink also allows for the easy installation of additional components such as heat fans and heat pipes.
The ATS-02G-55-C1-R0 thermal - heat sink is an excellent choice for dissipating the heat produced by high power electronic devices. Its effective design ensures maximum heat transfer while keeping components at a safe temperature. As it is made of lightweight materials, it can be easily installed in a variety of places. It is an effective and reliable solution for dissipating heat from power electronic components and should be considered in any application where heat dissipation is needed.
The specific data is subject to PDF, and the above content is for reference