ATS-02G-64-C1-R0

Thermal - Heat Sinks

The ATS-02G-64-C1-R0 is a thermal solution usually used in association with high-power electronic functions. The heat sink has a number of components working together to dissipate heat away from the loaded circuit boards and into the surrounding environment. In this article we will discuss the application field and working principle of the ATS-02G-64-C1-R0.

Application Field

The ATS-02G-64-C1-R0 is most commonly found in applications with high power boards requiring cooling solutions. These include large-scale digital signal processors (DSPs) and Field Programmable Gate Arrays (FPGAs) with high power, power amplifier circuits and other home/automotive electronics constructions that need to have a lot of heat removed from the component. Additionally, this heat sink is being used for high power devices such as graphic cards, power supplies, power converters, etc. All these applications require closed loop cooling systems, so the heat sink can be integrated in any kind of device requiring thermal management and sharing heat dissipation.

Working Principle

The ATS-02G-64-C1-R0 works by using a base plate, which is connected to the surrounding environment. The base plate is then connected to a series of heat pipes, which are filled with a special heat conductive liquid. When heat is produced by the components, the heat is absorbed by the liquid-filled heat pipes, which then dissipate this heat to the environment.

Also present in the heat sink are heat spreaders, which act as bridges between the base of the component and the heat pipes. This creates a larger surface area, which spreads the heat from the devices across the heat spreaders. This makes it easier for heat to be quickly and evenly dissipated across the heat sink.

Furthermore, there is also a built-in fan, which is used to push air into the heat sink, aiding in the heat dissipation process. The fan also helps keep the inside of the heat sink cool, and this allows the components to operate for longer periods of time without thermal overload.

Finally, the heat sink also consists of fins, which are made from anodized aluminum. These fins help to dissipate heat into the surrounding environment, and they also add structure and support to the heat sink.

Conclusion

The ATS-02G-64-C1-R0 is a thermal solution typically used in high power applications. It works by using a base plate and heat pipes filled with liquid, heat spreaders, a fan, and aluminum fins to dissipate heat away from the load and into the surrounding environment. This heat sink is an effective and efficient thermal solution for any application requiring a closed loop cooling system.