ATS-02G-70-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02G-70-C1-R0-ND

Manufacturer Part#:

ATS-02G-70-C1-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02G-70-C1-R0 datasheetATS-02G-70-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.69°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks are an important part of the engineering world. They are responsible for efficiently dissipating heat from electronic components so they can maintain proper temperature. This helps to ensure optimal performance, reliability, and longevity of the components. One of the most popular and reliable thermal solutions to date is the ATS-02G-70-C1-R0. This heat sink is used for a wide range of applications, and has an impressive performancerecord.

The ATS-02G-70-C1-R0 is a high-power, multi-layer thermal solution designed for industrial applications. It is composed of a set of 75-plate layers arranged in two separate configurations. Each configuration consists of a bottom and top plate, and the spacing between them is optimized for maximum heat dissipation. The bottom plate is made of soft aluminum alloy, while the top plate is made of high-performance copper. The two plates are connected to each other by a thermal adhesive, which helps to improve the transfer of heat energy.

The ATS-02G-70-C1-R0 works by transferring heat from electronic components to the heat sink through its many layers. By doing so, the heat is dissipated more evenly across the layers, reducing the temperature of the components and allowing them to work more effectively. The design also ensures that the heat dissipation rate is high, ensuring maximum efficiency and reliability.

The ATS-02G-70-C1-R0 is an ideal thermal solution for many different types of industrial applications, including automotive electronics, electrical and consumer products, and medical devices. It is one of the most reliable and efficient thermal solutions on the market. It offers superior scalability and can handle high thermal loads. It is also UL-certified, meaning it meets all necessary safety requirements.

The ATS-02G-70-C1-R0 is a cost-efficient thermal solution that provides superior heat dissipation and durability. It is an excellent choice for many industrial applications, and can be used to lower operating temperature of electronic components and improve their overall performance. The ATS-02G-70-C1-R0 is one of the best heat sinks available, and is sure to provide superior performance for many years to come.

The specific data is subject to PDF, and the above content is for reference

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