ATS-02G-82-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.97°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks

Heat sinks are an integral part of thermal management. They are used to dissipate excess heat from electronic components by acting as a “heat buffer” of sorts, reducing the temperature of the surrounding components. Heat sinks can be found in a variety of thermal applications, including computers, medical equipment, automotive components, and much more.One of the most common types of heat sinks used in today’s applications is the ATS-02G-82-C3-R0 heat sink. This type of heat sink is designed to dissipate heat at a rate of up to 300 watts. The ATS-02G-82-C3-R0 heat sink is an aluminum extrusion heat sink with a “cupped” design. This design allows it to better dissipate heat from a variety of sources, such as high-power LED lamps.

Application Field for ATS-02G-82-C3-R0 Heat Sinks

ATS-02G-82-C3-R0 heat sinks are most commonly used in applications that require high power dissipation. These heat sinks are ideal for high-powered LED lamps, as they can dissipate large amounts of heat without sacrificing performance. Additionally, ATS-02G-82-C3-R0 heat sinks are commonly used in power amplifiers, motor drivers, and other high-power electronic components.

Working Principle of ATS-02G-82-C3-R0 Heat Sinks

The ATS-02G-82-C3-R0 heat sink is designed to dissipate heat at a rate of up to 300 watts. This heat sink uses a “cupped” design, which helps it to better dissipate heat away from the device it is attached to. This design allows the heat sink to receive the maximum amount of heat from the device while still remaining relatively cool.The heat sink works by absorbing the heat from the device that it is attached to and then dissipating it away from the device. This process is facilitated by the heat generation from the device and the air circulating through the heat sink’s fins. As the air moves through the fins, it absorbs the heat from the device and dissipates it away from the device. This helps to keep the device cool and prevents it from overheating.

Conclusion

Heat sinks are an integral part of thermal management and are used to dissipate excess heat from electronic components. The ATS-02G-82-C3-R0 heat sink is designed to dissipate heat at a rate of up to 300 watts. It is an aluminum extrusion heat sink with a “cupped” design, allowing it to better dissipate heat from a variety of sources. It is most commonly used in applications that require high power dissipation, such as high-power LED lamps, power amplifiers, and motor drivers. The ATS-02G-82-C3-R0 heat sink works by absorbing the heat from the device and then dissipating it away from the device, helping to keep the device cool and prevent it from overheating.

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