| Allicdata Part #: | ATS-02H-09-C3-R0-ND |
| Manufacturer Part#: |
ATS-02H-09-C3-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02H-09-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47004 |
| 30 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential in a wide variety of applications, ranging from computer and consumer electronic systems to large-scale industrial processes. Heat-sinks are an essential part of any thermal management system. The ATS-02H-09-C3-R0 is a heat-sink designed to provide effective thermal dissipation in a variety of applications.
The ATS-02H-09-C3-R0 is specially designed to support up to 9 Watts of power dissipation, making it a suitable choice for many applications. The heat-sink is forged from a high-grade aluminum alloy, ensuring that it is durable and thermally efficient. The base of the heat-sink is machined to ensure flatness and accuracy. A black anodized finish on the aluminum ensures that the heat-sink is protected from corrosion and oxidation.
The ATS-02H-09-C3-R0 is designed to be installed into a system using two screws. The underside of the heat-sink is perforated to provide an area which allows the device it is attached to be cooled. In addition, the top of the heat-sink has two mounting holes which enable the mounting of either a fan or a thermally conductive pad. This enables the heat-sink to be used in systems which require additional cooling. The heat-sink is also designed to be able to mount directly onto most CPUs.
The ATS-02H-09-C3-R0 is suitable for use in a wide variety of applications, including computers, consumer electronic systems, LEDs, high power amplifiers, and small appliances. It is particularly suited to applications in which a low profile solution is required, such as the cooling of slim line notebook computers. The heat-sink is also suitable for use in automotive and industrial applications.
The ATS-02H-09-C3-R0 has an operating temperature range between -40°C and +105°C. This ensures that the heat-sink can be employed in environments with demanding temperature requirements. In addition, the heat-sink is designed to withstand mechanical and vibration loads, further enhancing its usability.
The working principle of the ATS-02H-09-C3-R0 is simple. The aluminum alloy from which the heat-sink is made is a very good conductor of heat. Therefore, when the device to which the heat-sink is attached produces heat, the heat is conducted away from the device and dissipated into the atmosphere. In addition, the top of the heat-sink features a rubberized surface which helps to reduce acoustic noise generated by the device it is cooling.
The ATS-02H-09-C3-R0 is an ideal choice for a variety of applications. Its compact design, durable construction, and versatile mounting options make it suitable for a wide range of uses. In addition, its operating temperature range and vibration resistance ensure that it can reliably provide thermal management in any application. As such, the ATS-02H-09-C3-R0 is an excellent choice for thermal management in any system.
The specific data is subject to PDF, and the above content is for reference