| Allicdata Part #: | ATS-02H-100-C3-R0-ND |
| Manufacturer Part#: |
ATS-02H-100-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02H-100-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a fundamental part of any electronic system. Heat Sinks are designed to provide a thermal connection between the electronics and the environment, and in many cases, are used to actively manage or control the temperature of the system to ensure reliable and optimal operation. ATS - 02H - 100 - C3 - R0 is an example of a thermal - heat sink, and this article will discuss its application field and working principle.
The ATS - 02H - 100 - C3 - R0 is a 2U height, open-ended heat sink designed for cooling applications. The open-ended design allows for maximum air flow to the electronics, and the 2U height provides a large surface area for effective heat dissipation. The heat sink is made of extruded aluminum with a black, anodized finish, and features “F”-shaped fins for improved thermal performance. The heat sink has an operating temperature range of -55 to +165°C, and is designed to dissipate up to 200 watts of heat.
The ATS - 02H - 100 - C3 - R0 is a great solution for a variety of applications. It is a popular choice for industrial, medical, aerospace, telecommunications, and even consumer electronic applications. It can be used in devices such as power supplies, CPUs, GPUs, and even small form-factor PCs. Additionally, its open-ended design makes it suitable for use in devices where space is at a premium, such as fanless enclosures and limited form factors.
The ATS - 02H - 100 - C3 - R0 is a simple, easy to use heat sink. It features integrated heat dissipating side fins and easy-to-install snap pins, making it simple to install and remove. The fins are designed to maximize air flow and reduce the temperature of the electronics, while the snap pins provide secure mounting to the device and a reliable connection. Additionally, the heat sink is lightweight and sturdy for extended use, and is available in both silver and black color options.
The ATS - 02H - 100 - C3 - R0 works by transferring heat from the device to the fins of the heat sink. The fins are designed in such a way that the air passing through them cools the heat sink. The heat is then dissipated into the environment. This process of heat transfer is known as heat dissipation, and the rate at which the heat is absorbed and dissipated is known as the thermal conductivity. The ATS - 02H - 100 - C3 - R0 has a higher thermal conductivity than most other thermal - heat sinks in its class, making it an effective cooling solution.
In conclusion, the ATS - 02H - 100 - C3 - R0 is a great thermal - heat sink solution for applications where reliability, efficiency, and cost-effectiveness cannot be sacrificed. Its open-ended design allows for maximum air flow, and its lightweight construction and easy-to-install snap pins make it a great choice for a variety of applications. Additionally, the thermal conductivity of the heat sink is higher than most other thermal - heat sinks, allowing it to dissipate heat quickly and efficiently.
The specific data is subject to PDF, and the above content is for reference