| Allicdata Part #: | ATS-02H-103-C1-R1-ND |
| Manufacturer Part#: |
ATS-02H-103-C1-R1 |
| Price: | $ 4.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X9.5MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02H-103-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.87513 |
| 30 +: | $ 3.65967 |
| 50 +: | $ 3.44434 |
| 100 +: | $ 3.22906 |
| 250 +: | $ 3.01379 |
| 500 +: | $ 2.79852 |
| 1000 +: | $ 2.74471 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.64°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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。Thermal management is essential for modern electronic systems and protecting these systems from excessive heat is important for proper functioning. Heat sinks are a common thermal management solution and they consist of a thermally conductive material like copper or aluminum that transfers heat away from an electronic component or parts of a system. The ATS-02H-103-C1-R1 is a custom heat sink designed for use in thermal management applications. This article will discuss the application field and working principle of this heat sink.
ATS-02H-103-C1-R1 Application Field
The ATS-02H-103-C1-R1 heat sink is designed to be used in a variety of electronic systems. It is ideal for use in telecommunications, consumer electronics, medical equipment, industrial automation, and automotive applications where cooling of components and the prevention of thermal runaway are of paramount importance. The heat sink is particularly useful in applications where space constraints are a concern as its small size allows it to be discreetly installed in tight areas.
ATS-02H-103-C1-R1 Working Principle
The ATS-02H-103-C1-R1 heat sink is constructed from highly thermally conductive materials, such as aluminum or copper, that are designed to effectively conduct heat away from the components that they are attached to. The heat sink also features a vented air-flow design which further helps to dissipate any heat that accumulates during operation. Additionally, the heat sink utilizes fins that increase the surface area in order to maximize heat dissipation. Finally, the heat sink is designed to be easily installed in tight spaces without any major modifications being required.
In summary, the ATS-02H-103-C1-R1 heat sink is a highly efficient thermal management solution that is designed for use in a variety of electronic systems. It is constructed from thermally conductive materials, such as aluminum or copper, and features an air-flow design and fins that enhance its heat dissipation capabilities. Additionally, it is designed to be easily installed in tight spaces without any major modifications being required.
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