| Allicdata Part #: | ATS-02H-109-C3-R1-ND |
| Manufacturer Part#: |
ATS-02H-109-C3-R1 |
| Price: | $ 5.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X9.5MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02H-109-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.65003 |
| 30 +: | $ 4.39152 |
| 50 +: | $ 4.13318 |
| 100 +: | $ 3.87488 |
| 250 +: | $ 3.61655 |
| 500 +: | $ 3.35823 |
| 1000 +: | $ 3.29365 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-02H-109-C3-R1 is a thermal - heat sink device that works to manage heat in various applications. This product is designed for high levels of thermal management from the assembly and, thereby, prolongs the life of components. It helps to evenly distribute heat over large areas, allowing for a maximum transfer of heat. The ATS-02H-109-C3-R1 is a very efficient and reliable device.
Its application field depends on the specific application in which the device is being used. The device can be used in automotive, aerospace, electronic devices, industrial, medical, and other facilities where thermal management is important. This device is especially beneficial in high-power applications to dissipate the heat generated by the system.
As for its working principle, it relies on passive thermal sinks to absorb and disperse heat away from critical system components. This device is made of an aluminum alloy with a low heat conductivity. Its design allows for efficient heat transfer without increasing the operating temperature of the system. As air passes over the device, the heat is transferred away from the components, dissipating the heat into the environment.
The device also utilizes heat pipes to help transfer the heat away from the components. This is done by creating a loop of liquid-filled pipes within the device that is highly efficient at thermal transfer. As the liquid within the loop is heated, it starts to evaporate and expand, pushing the hot air away from the system. As the heated air is pushed away, cooler air enters the system, resulting in the device\'s ability to efficiently transfer heat away from the components.
In addition to its efficient performance, the ATS-02H-109-C3-R1 is designed with an adjustable mounting system that allows it to be easily configured to fit within tight spaces. This helps to ensure that the device can be easily installed and adjusted to suit the specific needs of the application. It also features a built-in fan system to help deliver more efficient cooling performance.
The ATS-02H-109-C3-R1 is a thermal - heat sink device that has been designed for maximum performance and efficiency. Its adjustable mounting system allows it to be easily configured to fit within tight spaces, while its efficient heat transfer capabilities make it an ideal solution for dissipating the heat generated by high-power applications. Its design also features a built-in fan system to help deliver more efficient cooling performance.
The specific data is subject to PDF, and the above content is for reference