| Allicdata Part #: | ATS-02H-150-C3-R0-ND |
| Manufacturer Part#: |
ATS-02H-150-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02H-150-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important topic in many engineering fields. In particular, for electronic components that dissipate a lot of heat, thermal management is critical to prevent system damage. Heat sinks are one of the most common methods of thermal management used to dissipate heat away from electronic components. The ATS-02H-150-C3-R0 is a heat sink designed for high-powered applications.
The ATS-02H-150-C3-R0 is a large, aluminum heat sink with a thermal resistance of 0.3°C/W. The housing measures 6.103 inches (155mm) in diameter and 2.362 inches (60mm) in height, and features a layer of anodized aluminum for higher durability and a brighter aesthetic. The ATS-02H-150-C3-R0 also features a thick base for increased surface area and better heat dissipation. On the top, there are four mounting holes for easy installation in a variety of applications.
The ATS-02H-150-C3-R0 is designed for applications where a high degree of cooling is needed. Examples include industrial applications such as robotics, motion control, loudspeakers, and medical devices, as well as computer applications such as motherboards and graphic cards. The large size of the heat sink makes it suitable for large components, including power transistors, MOSFETs, power ICs, and other power electronics.
The ATS-02H-150-C3-R0 is a passive heat sink and relies on natural convection to transfer heat away from the components it is attached to. Natural convection is the transfer of heat from hot to cold, and is achieved by air moving in a convection cycle. As hot air rises, cooler air takes its place and heat is dissipated away from the components.
The ATS-02H-150-C3-R0 also works in tandem with other cooling methods, such as forced convection or liquid cooling. Forced convection involves using fans to increase air flow, while liquid cooling works by circulating liquid (usually water or ethylene glycol) over components to dissipate heat. The ATS-02H-150-C3-R0 is designed to maximize the performance of these cooling techniques by providing additional surface area for heat transfer.
In summary, the ATS-02H-150-C3-R0 is a large aluminum heat sink designed for high-powered applications that require efficient thermal management. It uses natural convection to move heat away from components, and can also be used in conjunction with other cooling methods such as forced convection or liquid cooling. The ATS-02H-150-C3-R0 is suitable for a variety of applications, including industrial and computer applications, and is an excellent choice for dissipating heat from large components.
The specific data is subject to PDF, and the above content is for reference