ATS-02H-153-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-02H-153-C3-R0-ND

Manufacturer Part#:

ATS-02H-153-C3-R0

Price: $ 3.91
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02H-153-C3-R0 datasheetATS-02H-153-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.55131
30 +: $ 3.35370
50 +: $ 3.15643
100 +: $ 2.95917
250 +: $ 2.76189
500 +: $ 2.56462
1000 +: $ 2.51530
Stock 1000Can Ship Immediately
$ 3.91
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.06°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks Application Field and Working Principle of ATS-02H-153-C3-R0

Heat sinks are commonly used in a variety of applications, including electronic devices, industrial machinery, and cooling systems. The application field of the ATS-02H-153-C3-R0 heat sink is no different; it is designed for use in a range of devices requiring maximum thermal protection and improved performance. This heat sink utilizes a patented fin design to move heat away from critical components, with a high level of effectiveness.

The working principle of the ATS-02H-153-C3-R0 heat sink is based on the principles of thermodynamics. Heat is generated by the device or equipment that is connected to the heat sink; the heat then moves from the point of generation to other parts of the device or environment. Heat is conducted away from the device via the fins of the heat sink on its surface, dissipating it into the surrounding air or environment. In this way, the heat is spread across a wide area, allowing for the device to remain cool and at the optimal temperature.

The fins on the ATS-02H-153-C3-R0 heat sink are designed to maximize the effectiveness of the heat transfer process. The surface area of the fins increases the contact area for the heat to be transferred from the device to the heat sink. The gap between each fin helps to reduce turbulence, allowing air to more easily flow over the heat sink, and assisting in the cooling process. Additionally, the material used for the fins is designed to be highly conductive, allowing for a greater level of heat transfer.

The ATS-02H-153-C3-R0 heat sink also employs an additional design feature known as a \'heatpipe\'. A heatpipe consists of a thin copper tube filled with a liquid which acts as a conductor. The heatpipe works by absorbing heat from the source and transferring it to the outside environment. This process is a very efficient means of removing heat, and as a result, the ATS-02H-153-C3-R0 heat sink is able to offer superior cooling performance.

The ATS-02H-153-C3-R0 heat sink is an excellent choice for any application requiring optimum thermal protection and superior performance. It is especially beneficial for applications where maximum heat transfer is essential, such as electronics and industrial machinery. The heat sink\'s patented fin design and heatpipe combination provide unbeatable thermal protection and performance, making it an ideal solution for any situation.

Conclusion

The ATS-02H-153-C3-R0 heat sink is a perfect choice for applications that require optimum thermal protection and improved performance. The patented fin design and heatpipe allow for maximum heat transfer, while the high level of conductivity ensures that the heat is dissipated in an efficient and effective manner. The ATS-02H-153-C3-R0 heat sink is ideal for a range of electronic and industrial applications, making it one of the most popular heat sinks on the market today.

The specific data is subject to PDF, and the above content is for reference

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