ATS-02H-174-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.98°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal-heat sinks are devices used to draw heat away from an electronic component or system to maintain optimal operating temperatures and subsequently maximize component longevity. The most commonly used and most efficient of thermal-heat sinks are constructed from metal such as aluminum or copper, which are usually shaped into pin or fin structures. The heat energy is invariably transported through thermal conduction and these heat sinks often use a combination of air convection and surface radiation to dissipate the energy and reduce the component temperature. The ATS-02H-174-C1-R0 is the latest innovation in thermal-heat sink technology, offering technicians and engineers an opportunity to increase thermal-heat sinking performance while reducing the size and weight of the heat sink unit.

ATS-02H-174-C1-R0 Description

The ATS-02H-174-C1-R0 is a thermal-heat sink designed for use with a wide variety of electronic components and systems. It is constructed from high-density fin aluminum, then treated with a durable and corrosion-resistant plating. This makes it highly resistant to damage and gives it a longer lifespan than traditional sink constructions. The ATS-02H-174-C1-R0 uses a patented fastening system to ensure that the sink stays securely attached during operation and features a streamlined design to reduce resistance and drag.

ATS-02H-174-C1-R0 Application Field

The ATS-02H-174-C1-R0 is an ideal solution for a variety of electronics-related applications. Its lightweight and durable construction make it well-suited for applications that require a very low amount of energy to operate, such as portable electronics and embedded systems. Furthermore, due to its compact size, the ATS-02H-174-C1-R0 is ideal for use in cramped or restricted spaces, such as those found in data centers or other large-scale networks.

ATS-02H-174-C1-R0 Working Principle

The ATS-02H-174-C1-R0 works by using a combination of thermal conduction and air convection to draw heat away from the electronic components and systems it is attached to. This process is initiated by the heat source, which raises the temperature of the fins on the ATS-02H-174-C1-R0 and causes them to expand. Expansion causes air to move through the fins at a higher rate of speed, cooling the fins and allowing heat to be drawn away from the components and dissipated into the surrounding environment.

Conclusion

The ATS-02H-174-C1-R0 thermal-heat sink is a highly efficient and versatile solution for reducing the temperature of electronic components and systems in a wide variety of applications. Its streamlined and lightweight construction make it suitable for use in restricted spaces and its durable construction and patented fastening system ensures optimal performance and a longer lifespan. This makes it an ideal choice for professionals looking to optimize their thermal-heat sinking performance.

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